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Effects of Substrate Pulse Bias Duty Cycle on the Microstructure and Mechanical Properties of Ti-Cu-N Films Deposited by Magnetic Field-Enhanced Arc Ion Plating 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2017, 卷号: 30, 期号: 2, 页码: 176-184
作者:  Zhao, Sheng-Sheng;  Zhao, Yan-Hui;  Cheng, Lv-Sha;  Denisov, Vladimir Viktorovich;  Koval, Nikolay Nikolaevich;  Yu, Bao-Hai;  Mei, Hai-Juan;  Zhao, SS (reprint author), Shenzhen Polytech, Sch Mech & Elect Engn, Shenzhen 518055, Peoples R China.
收藏  |  浏览/下载：152/0  |  提交时间：2017/08/17
Magnetic Field  Arc Ion Plating  Ti-cu-n Film  Residual Stress  Hardness