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Modulation on the twinning microstructure of Cu nanowires and its effect on oxidation behaviour 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2024, 卷号: 496, 页码: 12
作者:  Chen, Ke-Xin;  Gao, Li-Yin;  Meng, Zhi-Chao;  Liu, Zhi-Quan
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Nanowires  Electrodeposition  Nanotwinned copper  Growth behaviour  Oxide morphology  
Modulation on the twinning microstructure of Cu nanowires and its effect on oxidation behaviour 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2024, 卷号: 496, 页码: 12
作者:  Chen, Ke-Xin;  Gao, Li-Yin;  Meng, Zhi-Chao;  Liu, Zhi-Quan
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Nanowires  Electrodeposition  Nanotwinned copper  Growth behaviour  Oxide morphology  
Modulation on the twinning microstructure of Cu nanowires and its effect on oxidation behaviour 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2024, 卷号: 496, 页码: 12
作者:  Chen, Ke-Xin;  Gao, Li-Yin;  Meng, Zhi-Chao;  Liu, Zhi-Quan
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Nanowires  Electrodeposition  Nanotwinned copper  Growth behaviour  Oxide morphology  
Breaking Consecutive Hydrogen-Bond Network Toward High-Rate Hydrous Organic Zinc Batteries 期刊论文
ADVANCED ENERGY MATERIALS, 2023, 页码: 9
作者:  Cui, Changjun;  Han, Daliang;  Lu, Haotian;  Li, Zhiguo;  Zhang, Kangyu;  Zhang, Bo;  Guo, Xiaoxia;  Sun, Rui;  Ye, Xiaolin;  Gao, Jiachen;  Liu, Yingxin;  Guo, Yong;  Meng, Rongwei;  Wei, Chunguang;  Yin, Lichang;  Kang, Feiyu;  Weng, Zhe;  Yang, Quan-Hong
收藏  |  浏览/下载：11/0  |  提交时间：2024/01/07
hydrogen bonds  hydrous organic electrolytes  ionic diffusion  low temperature  Zn anodes  
Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor 期刊论文
IEEE TRANSACTIONS ON MAGNETICS, 2022, 卷号: 58, 期号: 4, 页码: 7
作者:  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：105/0  |  提交时间：2022/07/14
Fe-Ni  magnetic core  magnetic properties  nanocrystalline  on-chip microinductor  
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：256/0  |  提交时间：2021/10/15
Solder joint  Intermetallic compound  Mechanical property  Nano-indentation  First principle calculation  
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：136/0  |  提交时间：2021/03/15
The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
作者:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan
收藏  |  浏览/下载：163/0  |  提交时间：2021/02/02
AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack  
Composition dependent mobility and bandgaps in (La0.05BaxSr0.95-x)SnO3 epitaxial films 期刊论文
APPLIED PHYSICS LETTERS, 2020, 卷号: 117, 期号: 7, 页码: 5
作者:  Li, Kaifeng;  Gao, Qiang;  Zhao, Li;  Lv, Kai;  Yin, Lichang;  Liu, Qinzhuang
收藏  |  浏览/下载：112/0  |  提交时间：2021/02/02
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：174/0  |  提交时间：2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism