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Modulation on the twinning microstructure of Cu nanowires and its effect on oxidation behaviour 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2024, 卷号: 496, 页码: 12
作者:  Chen, Ke-Xin;  Gao, Li-Yin;  Meng, Zhi-Chao;  Liu, Zhi-Quan
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Nanowires  Electrodeposition  Nanotwinned copper  Growth behaviour  Oxide morphology  
Modulation on the twinning microstructure of Cu nanowires and its effect on oxidation behaviour 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2024, 卷号: 496, 页码: 12
作者:  Chen, Ke-Xin;  Gao, Li-Yin;  Meng, Zhi-Chao;  Liu, Zhi-Quan
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Nanowires  Electrodeposition  Nanotwinned copper  Growth behaviour  Oxide morphology  
Modulation on the twinning microstructure of Cu nanowires and its effect on oxidation behaviour 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2024, 卷号: 496, 页码: 12
作者:  Chen, Ke-Xin;  Gao, Li-Yin;  Meng, Zhi-Chao;  Liu, Zhi-Quan
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Nanowires  Electrodeposition  Nanotwinned copper  Growth behaviour  Oxide morphology  
Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor 期刊论文
IEEE TRANSACTIONS ON MAGNETICS, 2022, 卷号: 58, 期号: 4, 页码: 7
作者:  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：105/0  |  提交时间：2022/07/14
Fe-Ni  magnetic core  magnetic properties  nanocrystalline  on-chip microinductor  
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
作者:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：113/0  |  提交时间：2022/07/01
Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn  
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
作者:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
收藏  |  浏览/下载：120/0  |  提交时间：2022/01/27
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
作者:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：256/0  |  提交时间：2021/10/15
Solder joint  Intermetallic compound  Mechanical property  Nano-indentation  First principle calculation  
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
作者:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：136/0  |  提交时间：2021/03/15
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin;  Xiong, Xiaodong
收藏  |  浏览/下载：172/0  |  提交时间：2021/02/02
Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism  
Focused ion beam preparation of microbeams forin situmechanical analysis of electroplated nanotwinned copper with probe type indenters 期刊论文
JOURNAL OF MICROSCOPY, 2020, 卷号: 279, 期号: 3, 页码: 212-216
作者:  Robertson, Stuart;  Doak, Scott;  Sun, Fu-Long;  Liu, Zhi-Quan;  Liu, Changqing;  Zhou, Zhaoxia
收藏  |  浏览/下载：126/0  |  提交时间：2021/02/02
Chunk lift-out  focused ion beam  in situ  micromechanical testing  nanotwinned copper  P-FIB