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Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 46, 页码: 1-11
作者:  Zhang, Jian Yang;  Xu, Bin;  Tariq, Naeemul Haq;  Sun, MingYue;  Li, DianZhong;  Li, Yi Yi
收藏  |  浏览/下载：182/0  |  提交时间：2021/02/02
Isothermal compression bonding  Dynamic recrystallization  Microstructures  Grain boundary  Misorientation  
Microstructure evolutions and interfacial bonding behavior of Ni-based superalloys during solid state plastic deformation bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 46, 页码: 1-11
作者:  Zhang, Jian Yang;  Xu, Bin;  Tariq, Naeemul Haq;  Sun, MingYue;  Li, DianZhong;  Li, Yi Yi
收藏  |  浏览/下载：186/0  |  提交时间：2021/02/02
Isothermal compression bonding  Dynamic recrystallization  Microstructures  Grain boundary  Misorientation