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Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
收藏  |  浏览/下载：114/0  |  提交时间：2021/02/02
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
作者:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
收藏  |  浏览/下载：116/0  |  提交时间：2021/02/02
The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781
作者:  Du, Yahong;  Liu, Zhi-Quan;  Ji, Hongjun;  Li, Mingyu;  Wen, Ming
收藏  |  浏览/下载：104/0  |  提交时间：2021/02/02
The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781
作者:  Du, Yahong;  Liu, Zhi-Quan;  Ji, Hongjun;  Li, Mingyu;  Wen, Ming
收藏  |  浏览/下载：96/0  |  提交时间：2021/02/02