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Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays 期刊论文
APPLIED THERMAL ENGINEERING, 2025, 卷号: 263, 页码: 11
作者:  Wu, Zhitao;  Wang, Wendong;  Bao, Ding;  Wei, Song;  Li, Ruifeng;  Guo, Jingdong
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Liquid metal  Thermal-interface material  Non-contact jetting  Wetting characteristic  Heat-transfer performance  
Wetting characteristics and interfacial heat-transfer performance of non-contact jetted liquid-metal arrays 期刊论文
APPLIED THERMAL ENGINEERING, 2025, 卷号: 263, 页码: 11
作者:  Wu, Zhitao;  Wang, Wendong;  Bao, Ding;  Wei, Song;  Li, Ruifeng;  Guo, Jingdong
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Liquid metal  Thermal-interface material  Non-contact jetting  Wetting characteristic  Heat-transfer performance  
Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
收藏  |  浏览/下载：8/0  |  提交时间：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
Effect of Cu/Ga interfacial reaction on heat transfer performance 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 17, 页码: 10
作者:  Du, Xinyu;  Wang, Wendong;  Ding, Zifeng;  Wang, Xiaojing;  Qiao, Yanxin;  Wei, Song;  Zhu, Qingsheng;  Guo, Jingdong
收藏  |  浏览/下载：9/0  |  提交时间：2024/01/07
Fabrication of liquid metal/diamond hybrid thermal interface materials with high thermal conductivity and low flowability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2023, 卷号: 34, 期号: 18, 页码: 16
作者:  Wang, Wendong;  Wei, Song;  Du, Xinyu;  Ding, Zifeng;  Zhu, Qingsheng;  Qiao, Yanxin;  Wang, Xiaojing;  Guo, Jingdong
收藏  |  浏览/下载：11/0  |  提交时间：2024/01/08
Investigations on the Thermal Conductivity of Micro-Scale Cu-Sn Intermetallic Compounds Using Femtosecond Laser Time-Domain Thermoreflectance System 期刊论文
ACTA METALLURGICA SINICA, 2022, 卷号: 58, 期号: 12, 页码: 1645-1654
作者:  Zhou Lijun;  Wei Song;  Guo Jingdong;  Sun Fangyuan;  Wang Xinwei;  Tang Dawei
收藏  |  浏览/下载：38/0  |  提交时间：2023/05/09
femtosecond laser  time-domain thermoreflectance  intermetallic compounds  thermal conductivity  
Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7
作者:  Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong
收藏  |  浏览/下载：38/0  |  提交时间：2023/05/09
Thermal properties  Microstructural analysis  Vacuum infusion  Particle-reinforcement  
Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal 期刊论文
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2022, 卷号: 162, 页码: 7
作者:  Wei, Song;  Wang, Wendong;  Zhou, Lijun;  Guo, Jingdong
收藏  |  浏览/下载：36/0  |  提交时间：2023/05/09
Thermal properties  Microstructural analysis  Vacuum infusion  Particle-reinforcement  
Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor 期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11
作者:  Wei, Xiang-Fu;  Zhu, Qing-Sheng;  Guo, Jing-Dong;  Shang, Jian-Ku
收藏  |  浏览/下载：109/0  |  提交时间：2021/11/22
Copper electroplating  Throwing power (TP)  Flexible printed circuit (FPC)  Suppressor  
Fabrication of high-conductivity RGO film at a temperature lower than 1500 degrees C by electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 10
作者:  Lv, Meijuan;  Wei, Qinwei;  Cao, Shuo;  Guo, Jingdong;  Ren, Wencai;  Cheng, Huiming
收藏  |  浏览/下载：152/0  |  提交时间：2021/10/15