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Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR;  Suganuma, K;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.;  Zhang, H (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：144/0  |  提交时间：2018/06/05
Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth  
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD;  Zhang, L;  Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：112/0  |  提交时间：2018/06/05
Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion  
Preparation of poly(vinyl alcohol)-based separator with pore-forming additive for lithium-ion batteries 期刊论文
SPRINGER, 2017, 卷号: 28, 期号: 23, 页码: 17516-17525
作者:  Xiao, Wei;  Zhang, Kaiyue;  Liu, Jianguo;  Yan, Chuanwei;  Xiao, W (reprint author), Chinese Acad Sci, Inst Met Res, Lab Corros & Protect, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：111/0  |  提交时间：2018/01/10
Magnetotransport in Ultrathin 2-D Superconducting Mo2C Crystals 期刊论文
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 2017, 卷号: 53, 期号: 11, 页码: -
作者:  Song, Shuang;  Wang, Libin;  Xu, Chuan;  Cheng, Hui-Ming;  Ren, Wencai;  Kang, Ning;  Kang, N (reprint author), Peking Univ, Key Lab Phys & Chem Nanodevices, Beijing 100871, Peoples R China.;  Kang, N (reprint author), Peking Univ, Dept Elect, Beijing 100871, Peoples R China.
收藏  |  浏览/下载：120/0  |  提交时间：2018/01/10
2-d Superconductivity  Chemical Vapor Deposition (Cvd)  Transition Metal Carbides (Tmcs)  Magnetotransport  
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
作者:  Gao, Li-Yin;  Liu, Zhi-Quan;  Li, Cai-Fu;  Liu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
收藏  |  浏览/下载：133/0  |  提交时间：2017/08/17
Fe-ni Under Bump Metallization (Ubm)  Thermal Cycling  Microstructural Evolution  Lifetime  Recrystallization  Electron Backscatter Diffraction (Ebsd)  
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
作者:  Wang, Mingna;  Wang, Jianqiu;  Ke, Wei;  Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
收藏  |  浏览/下载：128/0  |  提交时间：2017/08/17
Lead-free Solder Joint  Corrosion  Microstructure  Solidification Cracks  
A superior interfacial reliability of Fe-Ni UBM during high temperature storage 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 期号: 12, 页码: 8537-8545
作者:  Gao, Li-Yin;  Li, Cai-Fu;  Wan, Peng;  Liu, Zhi-Quan;  Li, CF;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
收藏  |  浏览/下载：115/0  |  提交时间：2017/08/17
n(+)Si/pGe Heterojunctions Fabricated by Low Temperature Ribbon Bonding With Passivating Interlayer 期刊论文
IEEE ELECTRON DEVICE LETTERS, 2017, 卷号: 38, 期号: 6, 页码: 716-719
作者:  Liu, Tony Chi;  Kabuyanagi, Shoichi;  Nishimura, Tomonori;  Yajima, Takeaki;  Toriumi, Akira;  Liu, TC (reprint author), Univ Tokyo, Dept Mech Engn, Tokyo 1138656, Japan.
收藏  |  浏览/下载：110/0  |  提交时间：2017/08/17
Germanium  Heterojunctions  Passivation  Interlayer  Bonding  
The reliability of copper pillar under the coupling of thermal cycling and electric current stressing 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 期号: 9, 页码: 9748-9754
作者:  Ma, HC;  Guo, JD;  Chen, JQ;  Wu, D;  Liu, ZQ;  Zhu, QS;  Zhang, L;  Guo, HY;  Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
收藏  |  浏览/下载：100/0  |  提交时间：2016/12/28