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Effect of liquid droplet impingement on electrochemical passivation behavior of 321 stainless steel in 0.5 wt% NaCl solution 期刊论文
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2024, 卷号: 33, 页码: 7795-7807
作者:  Du, Shuangyu;  Cui, Yu;  Liu, Rui;  Xue, Weihai;  Wang, Fuhui;  Liu, Li
收藏  |  浏览/下载:3/0  |  提交时间:2025/04/27
Liquid droplet impingement  Residual compressive stress  Surface roughness  Passive film  Electronic characterization  
First-principles study on the metallic antiferromagnet Co PhPO3 center dot H2O 期刊论文
Journal of Magnetism and Magnetic Materials, 2007, 卷号: 312, 期号: 1, 页码: 16-20
作者:  K. L. Yao;  X. L. Li;  Z. L. Liu;  Y. L. Li;  G. Y. Gao
收藏  |  浏览/下载:73/0  |  提交时间:2012/04/13
First Principles  Electronic Structure  Magnetic Properties  Transition  Metal Phosphonate  Structural Characterization  Crystal-structure  Organophosphonates  Chemistry  Chain  
First-principles studies on the conductive and ferromagnetic properties of Mn(ins)( mu(1,1)-N-3(CH3OH) (2) 期刊论文
Physica B-Condensed Matter, 2007, 卷号: 392, 期号: 1-2, 页码: 318-322
作者:  K. L. Yao;  N. Liu;  Z. L. Liu;  Y. L. Li;  G. Y. Gao
收藏  |  浏览/下载:66/0  |  提交时间:2012/04/13
First Principles  Azido Group  Ferromagnetic  Electronic Structure  Copper (Ii)-azido Compound  End-on Azido  Magnetic-properties  Magnetostructural Correlations  Structural-characterization  Nickel(Ii)  Complexes  Electronic-structure  Crystal-structures  Bridging Ligand  Systems  
Ca, Pd, Sn and La effects on the electronic structure of MgH2 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2004, 卷号: 33, 期号: 5, 页码: 485-489
作者:  Chen, D;  Chen, L;  Wang, YM;  Liu, S
收藏  |  浏览/下载:101/0  |  提交时间:2021/02/02
Mg(M)H-2(M=Ca,Pd,Sn,La)  discrete variational method(DVM)  electronic structure  bonding characterization  
Ca, Pd, Sn and La effects on the electronic structure of MgH2 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2004, 卷号: 33, 期号: 5, 页码: 485-489
作者:  Chen, D;  Chen, L;  Wang, YM;  Liu, S
收藏  |  浏览/下载:106/0  |  提交时间:2021/02/02
Mg(M)H-2(M=Ca,Pd,Sn,La)  discrete variational method(DVM)  electronic structure  bonding characterization