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The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
收藏  |  浏览/下载：137/0  |  提交时间：2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Growth behavior of intermetallic compounds at Sn-Ag/Cu joint interfaces revealed by 3D imaging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2015, 卷号: 646, 页码: 405-411
作者:  Zhang, Q. K.;  Long, W. M.;  Zhang, Z. F.;  qkzhang@alum.imr.ac.cn;  zhfzhang@imr.ac.cn
收藏  |  浏览/下载：116/0  |  提交时间：2016/04/21
Lead-free Solder  Intermetallic Compounds  3d Imaging  Thermal Aging  Grain Boundary  
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
作者:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
收藏  |  浏览/下载：101/0  |  提交时间：2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
作者:  L. M. Yang;  Z. F. Zhang
收藏  |  浏览/下载：110/0  |  提交时间：2013/12/24
Lead-free Solder  Intermetallic Compounds  Interfacial Reaction  Grain  Growth  Sn-ag-cu  Shear-strength  Mechanical-properties  Rare-earth  Bga Joints  Alloy  Electromigration  Reliability  
A highly active porous Pt-PbOx/C catalyst toward alcohol electro-oxidation in alkaline electrolyte 期刊论文
International Journal of Hydrogen Energy, 2013, 卷号: 38, 期号: 29, 页码: 12767-12773
作者:  G. L. Li;  L. H. Jiang;  B. S. Zhang;  Q. Jiang;  D. S. Su;  G. Q. Sun
收藏  |  浏览/下载：110/0  |  提交时间：2013/12/24
Alcohol Electro-oxidation  Alkaline Electrolyte  Electrocatalysts  Platinum-lead Oxide  Methanol Electrooxidation  Intermetallic Compounds  Oxidation  Platinum  Acid  
Influences of reflow time and strain rate on interfacial fracture behaviors of Sn-4Ag/Cu solder joints 期刊论文
Journal of Applied Physics, 2012, 卷号: 112, 期号: 6
作者:  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：90/0  |  提交时间：2013/02/05
Lead-free Solders  To-brittle Transition  Intermetallic Compounds  Deformation-behavior  Tensile Properties  Shear-strength  Sn  Sn-3.5ag  Tin  Cu  
Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn-3Cu/Cu joints 期刊论文
Scripta Materialia, 2012, 卷号: 67, 期号: 7-8, 页码: 637-640
作者:  L. M. Yang;  Q. K. Zhang;  Z. F. Zhang
收藏  |  浏览/下载：88/0  |  提交时间：2013/02/05
Solder Joint  Interfaces  Intermetallic Compounds  Fracture  Shear  Strength  Lead-free Solder  Brazed Joints  Size  Sn  Microstructure  Deformation  Reliability  Failure  Copper  Cu  
In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 530, 页码: 452-461
作者:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(1086Kb)  |  收藏  |  浏览/下载：114/0  |  提交时间：2012/04/13
In-situ Observation  Intermetallic Compounds  Interface  Fracture  Dislocation Pile-up  Cumulative Stress  Lead-free Solders  Intermetallic Compounds  Mechanical-properties  Fatigue Damage  Joints  Sn-3.5ag  Polycrystalline  Interfaces  Morphology  Evolution  
The origin of large overestimation of the magnetic entropy changes calculated directly by Maxwell relation 期刊论文
Applied Physics Letters, 2010, 卷号: 96, 期号: 22
作者:  W. B. Cui;  W. Liu;  Z. D. Zhang
Adobe PDF(553Kb)  |  收藏  |  浏览/下载：149/0  |  提交时间：2012/04/13
Lead Compounds  Magnetic Hysteresis  Magnetoelectric Effects  Metallic  Glasses  Tuning  Adiabatic Temperature-change  Gd5si2ge2  
Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints 期刊论文
Microelectronic Engineering, 2010, 卷号: 87, 期号: 4, 页码: 601-609
作者:  H. F. Zou;  Z. F. Zhang
Adobe PDF(1205Kb)  |  收藏  |  浏览/下载：84/0  |  提交时间：2012/04/13
Sn-cu Solder  Interfacial Strength  Intermetallic Compounds  Ductile-to-brittle Transition  Strain Rate  Fracture  Lead-free Solders  Intermetallic Compounds  Tensile Properties  Microstructure  Growth  Alloy