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Flash soldering of boron nitride nanosheets for all-ceramic films 期刊论文
CHEMICAL ENGINEERING JOURNAL, 2024, 卷号: 491, 页码: 11
作者:  Ding, Siyuan;  Zhan, Ke;  Du, Yu;  Zhen, Fangzheng;  Zhu, Jiuyi;  Ding, Baofu;  Yu, Aibing;  Liu, Minsu;  Cheng, Hui-Ming;  Qiu, Ling
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Boron Nitride  2D materials  Flash soldering  Ceramic film  Thermal management  
Strong Connection of Single-Wall Carbon Nanotube Fibers with a Copper Substrate Using an Intermediate Nickel Layer 期刊论文
ACS NANO, 2023, 卷号: 17, 期号: 18, 页码: 18290-18298
作者:  Gao, Zhaoqing;  Xu, Lele;  Jiao, Xinyu;  Li, Xin;  He, Chengjian;  Wang, Hao-Zike;  Sun, Chunyang;  Hou, Peng-Xiang;  Liu, Chang;  Cheng, Hui-Ming
收藏  |  浏览/下载：9/0  |  提交时间：2024/01/08
single-wall carbon nanotube fiber  heterogeneous interconnection  interfacial bonding  electrical conductivity  soldering  intermediate Ni layer  
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin;  Xiong, Xiaodong
收藏  |  浏览/下载：172/0  |  提交时间：2021/02/02
Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：175/0  |  提交时间：2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
收藏  |  浏览/下载：141/0  |  提交时间：2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
A new quantizing insulator soldering technology scheme for microwave module 期刊论文
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2019, 卷号: 61, 期号: 4, 页码: 979-984
作者:  Tian, Fei-Fei;  Zhou, Ming;  Zhang, Jun Zhi
收藏  |  浏览/下载：114/0  |  提交时间：2021/02/02
microwave module  quatization  soldering  solid solder ring  
A new quantizing insulator soldering technology scheme for microwave module 期刊论文
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2019, 卷号: 61, 期号: 4, 页码: 979-984
作者:  Tian, Fei-Fei;  Zhou, Ming;  Zhang, Jun Zhi
收藏  |  浏览/下载：104/0  |  提交时间：2021/02/02
microwave module  quatization  soldering  solid solder ring  
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
作者:  Xu Zhiwu;  Li Zhengwei;  Luo Xiaoyu;  Ji Shude;  Yan Jiuchun
收藏  |  浏览/下载：146/0  |  提交时间：2021/02/02
ultrasonic soldering  spreading frontier  oxide film  finite element simulation  elimination measure  
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
作者:  Xu Zhiwu;  Li Zhengwei;  Luo Xiaoyu;  Ji Shude;  Yan Jiuchun
收藏  |  浏览/下载：137/0  |  提交时间：2021/02/02
ultrasonic soldering  spreading frontier  oxide film  finite element simulation  elimination measure  
Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces 期刊论文
ACTA MATERIALIA, 2016, 卷号: 104, 页码: 1-8
作者:  Zhang, Z. H.;  Li, M. Y.;  Liu, Z. Q.;  Yang, S. H.;  zhzhang@xmu.edu.cn;  myli@hit.edu.cn
收藏  |  浏览/下载：107/0  |  提交时间：2016/04/21
Intermetallic Compounds  Microstructure Formation Mechanism  Cu Single Crystal  Orientation  Soldering