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Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
收藏  |  浏览/下载：5/0  |  提交时间：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
Heterogeneous microstructure and voids dependence of tensile deformation in a selective laser melted AlSi10Mg alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 798, 页码: 11
作者:  Ben, D. D.;  Ma, Y. R.;  Yang, H. J.;  Meng, L. X.;  Shao, X. H.;  Liu, H. Q.;  Wang, S. G.;  Duan, Q. Q.;  Zhang, Z. F.
收藏  |  浏览/下载：217/0  |  提交时间：2021/02/02
AlSi10Mg alloy  Selective laser melting  Heterogeneous microstructures  Strain localization  Voids  
Heterogeneous microstructure and voids dependence of tensile deformation in a selective laser melted AlSi10Mg alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 798, 页码: 11
作者:  Ben, D. D.;  Ma, Y. R.;  Yang, H. J.;  Meng, L. X.;  Shao, X. H.;  Liu, H. Q.;  Wang, S. G.;  Duan, Q. Q.;  Zhang, Z. F.
收藏  |  浏览/下载：220/0  |  提交时间：2021/02/02
AlSi10Mg alloy  Selective laser melting  Heterogeneous microstructures  Strain localization  Voids  
Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 792, 页码: 10
作者:  Yang, Yu-Jia;  Zhang, Bin;  Wan, Hong-Yuan;  Zhang, Guang-Ping
收藏  |  浏览/下载：114/0  |  提交时间：2021/02/02
Cu  Graphene  Interface  Fatigue extrusions  Voids  
Interface facilitated transformation of voids directly into stacking fault tetrahedra 期刊论文
ACTA MATERIALIA, 2020, 卷号: 188, 页码: 623-634
作者:  Kong, X. F.;  Gao, N.;  Beyerlein, I. J.;  Yao, B. N.;  Zheng, S. J.;  Ma, X. L.;  Legut, D.;  Germann, T. C.;  Zhang, H. J.;  Zhang, R. F.
收藏  |  浏览/下载：151/0  |  提交时间：2021/02/02
Voids  Stacking fault tetrahedron  Interface  Transformation  Dislocation  Damage  
Interface facilitated transformation of voids directly into stacking fault tetrahedra 期刊论文
ACTA MATERIALIA, 2020, 卷号: 188, 页码: 623-634
作者:  Kong, X. F.;  Gao, N.;  Beyerlein, I. J.;  Yao, B. N.;  Zheng, S. J.;  Ma, X. L.;  Legut, D.;  Germann, T. C.;  Zhang, H. J.;  Zhang, R. F.
收藏  |  浏览/下载：152/0  |  提交时间：2021/02/02
Voids  Stacking fault tetrahedron  Interface  Transformation  Dislocation  Damage  
The premature necking of twinning-induced plasticity steels 期刊论文
PERGAMON-ELSEVIER SCIENCE LTD, 2017, 卷号: 136, 页码: 1-10
作者:  Yang, C. L.;  Zhang, Z. J.;  Zhang, P.;  Zhang, Z. F.;  Zhang, ZJ;  Zhang, ZF (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：95/0  |  提交时间：2018/01/10
Twinning-induced Plasticity Steel  Voids  Necking  Strain-hardening Rate  
New preparation method of micron porous copper through physical vacuum dealloying of Cu-Zn alloys 期刊论文
MATERIALS LETTERS, 2016, 卷号: 165, 页码: 1-4
作者:  Sun, Yuxia;  Ren, Yibin;  Yang, Ke
收藏  |  浏览/下载：119/0  |  提交时间：2016/04/21
Porous Materials  Dealloying  Diffusion  Kirkendall Voids  Sublimation  Cu-zn Alloy  
Pentavacancy as the key nucleus for vacancy clustering in aluminum 期刊论文
Physical Review B, 2011, 卷号: 84, 期号: 22
作者:  H. Wang;  D. Rodney;  D. S. Xu;  R. Yang;  P. Veyssiere
Adobe PDF(664Kb)  |  收藏  |  浏览/下载：116/0  |  提交时间：2012/04/13
Quenched Aluminum  Fcc Metals  Electrical Resistivity  Dislocation  Dipoles  Transformation  Annihilation  Simulation  Kinetics  Voids  
Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 8, 页码: 737-742
作者:  X. J. Wang;  Q. L. Zeng;  Q. S. Zhu;  Z. G. Wang;  J. K. Shang
Adobe PDF(966Kb)  |  收藏  |  浏览/下载：139/0  |  提交时间：2012/04/13
Strength  Fracture Strain  Voids  Solder  Al Interconnects  Electromigration  Growth  Lines  Sn