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Effect of carbon on the microstructure and element distribution in Ti42Al5Mn alloy 期刊论文
MATERIALS SCIENCE AND TECHNOLOGY, 2020, 卷号: 36, 期号: 17, 页码: 1883-1892
Authors:  Tang, Hongjian;  Li, Xiaobing;  Xing, Weiwei;  Ma, Yingche;  Chen, Bo;  Liu, Kui;  Xia, Yuanhua;  Lin, Kun
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γ  -TiAl  Carbon  microstructure  solubility  Ti2AlC  phase evolution  element distribution  neutron powder diffraction  
Achieving a High-Strength CoCrFeNiCu High-Entropy Alloy with an Ultrafine-Grained Structure via Friction Stir Processing 期刊论文
金属学报:英文版, 2020, 卷号: 33.0, 期号: 007, 页码: 947-956
Authors:  CunLei Jia;  ZhiWei Wang;  LiHui Wu;  DingRui Ni;  ZhengKun Li;  HuaMeng Fu;  Peng Xue;  BoLv Xiao;  ZongYi Ma;  Yi Shao;  YunLong Chang
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grain  microstructure  deformation  
Exome sequencing confirms molecular diagnoses in 38 Chinese families with hereditary spherocytosis 期刊论文
SCIENCE CHINA-LIFE SCIENCES, 2018, 卷号: 61, 期号: 8, 页码: 947-953
Authors:  Wang Rongrong;  Yang Shuanghao;  Xu Ming;  Huang Jia;  Liu Hongyan;  Gu Weiyue;  Zhang Xue
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RED-CELL MEMBRANE  HEMATOLOGICALLY IMPORTANT MUTATIONS  RENAL TUBULAR-ACIDOSIS  HEMOLYTIC-ANEMIA  BETA-SPECTRIN  CYTOPLASMIC DOMAIN  BAND-3 DEFICIENCY  DISORDERS  ANKYRIN  VARIANTS  hereditary spherocytosis  mutation  ANK1  SPTB  SLC4A1  whole-exome sequencing  
Exome sequencing confirms molecular diagnoses in 38 Chinese families with hereditary spherocytosis 期刊论文
SCIENCE CHINA-LIFE SCIENCES, 2018, 卷号: 61, 期号: 8, 页码: 947-953
Authors:  Wang Rongrong;  Yang Shuanghao;  Xu Ming;  Huang Jia;  Liu Hongyan;  Gu Weiyue;  Zhang Xue
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RED-CELL MEMBRANE  HEMATOLOGICALLY IMPORTANT MUTATIONS  RENAL TUBULAR-ACIDOSIS  HEMOLYTIC-ANEMIA  BETA-SPECTRIN  CYTOPLASMIC DOMAIN  BAND-3 DEFICIENCY  DISORDERS  ANKYRIN  VARIANTS  hereditary spherocytosis  mutation  ANK1  SPTB  SLC4A1  whole-exome sequencing  
An effect of crystal tilt on the determination of ions displacements in perovskite oxides under BF/HAADF-STEM imaging mode 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2017, 卷号: 32, 期号: 5, 页码: 947-956
Authors:  Liu, Y.;  Zhu, Y. L.;  Tang, Y. L.;  Ma, X. L.;  Ma, XL (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
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Solidification of nitrogen-atomized Al(86)Ni(6)Y(4.5)Co(2)La(1.5) metallic glass 期刊论文
Journal of Materials Research, 2011, 卷号: 26, 期号: 7, 页码: 944-950
Authors:  M. Yan;  J. Q. Wang;  G. B. Schaffer;  M. Qian
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Forming Ability  Gas-atomization  Homogeneous Structures  Alloys  Nucleation  Yttrium  Systems  Powders  Ti  Microstructure  
Large reversible magnetocaloric effect in HoTiO(3) single crystal 期刊论文
Journal of Applied Physics, 2011, 卷号: 110, 期号: 8
Authors:  Y. T. Su;  Y. Sui;  J. G. Cheng;  X. J. Wang;  Y. Wang;  W. F. Liu;  X. Y. Liu
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Magnetic Refrigeration  Transitions  Oxides  Rtio3  Tb  Ho  Dy  
Effect of eutectic Si on surface nanocrystallization of Al-Si alloys by surface mechanical attrition treatment 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 530, 页码: 304-314
Authors:  H. W. Chang;  P. M. Kelly;  Y. N. Shi;  M. X. Zhang
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Smat  Al-si Cast Alloy  Nanocrystalline Material  Grain Refinement  Dislocation Gliding  Induced Grain-refinement  Pure Titanium  Steel  Layer  Evolution  
Excellent room-temperature ductility and formability of rolled Mg-Gd-Zn alloy sheets 期刊论文
Journal of Alloys and Compounds, 2011, 卷号: 509, 期号: 6, 页码: 2856-2863
Authors:  D. Wu;  R. S. Chen;  E. H. Han
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Magnesium Alloys  Rolled Sheet  Non-basal Texture  Ductility  Formability  Magnesium-based Alloys  Stretch Formability  Mechanical-properties  Tensile Ductility  Texture  Deformation  Enhancement  Anisotropy  Recrystallization  
Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect 期刊论文
Journal of Alloys and Compounds, Journal of Alloys and Compounds, 2011, 2011, 卷号: 509, 509, 期号: 5, 页码: 1785-1789, 1785-1789
Authors:  T. Y. Kang;  Y. Y. Xiu;  C. Z. Liu;  L. Hui;  J. J. Wang;  W. P. Tong
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Bi Segregation  Bi Segregation  Interconnect  Interconnect  Kinetics  Kinetics  Intermetallic Compound Growth  Intermetallic Compound Growth  Lead-free Solders  Lead-free Solders  Cu  Cu