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| Wetting Behavior and Interfacial Characteristics in the Molten Bi-Sn/High-Entropy Alloy System 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 8, 页码: 2500-2505
Authors: Ma Guofeng; Zhang Hongling; Sun Lina; He Chunlin; Zhang Bo; Zhang Haifeng
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high entropy alloy Bi-Sn molten alloy wettability interface wetting mechanism |
| Bi-Sn熔体在高熵合金上的润湿行为及界面特征 期刊论文
稀有金属材料与工程, 2018, 卷号: 47.0, 期号: 008, 页码: 2500-2505
Authors: 马国峰; 张鸿龄; 孙俪娜; 贺春林; 张波; 张海峰
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高熵合金 Bi-Sn熔体 润湿 界面特征 润湿机制 |
| STUDY ON THE BEHAVIOUR OF BUBBLES IN A CONTINUOUS CASTING MOLD WITH Ar INJECTION AND TRAVELING MAGNETIC FIELD 期刊论文
ACTA METALLURGICA SINICA, 2012, 卷号: 48, 期号: 8, 页码: 951-956
Authors: Chen Zhihui; Wang Engang; Zhang Xingwu; Wang Yuanhua; Zhu Mingwei; He Jicheng
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MOLTEN STEEL FLOW FLUID-FLOW NUMERICAL-SIMULATION ELECTROMAGNETIC BRAKE MULTIPHASE FLOW ENTRAPMENT MECHANISM SPEED MODEL model experiment continuous casting mold low frequency traveling magnetic field resistance probe bubbles distribution |
| STUDY ON THE BEHAVIOUR OF BUBBLES IN A CONTINUOUS CASTING MOLD WITH Ar INJECTION AND TRAVELING MAGNETIC FIELD 期刊论文
ACTA METALLURGICA SINICA, 2012, 卷号: 48, 期号: 8, 页码: 951-956
Authors: Chen Zhihui; Wang Engang; Zhang Xingwu; Wang Yuanhua; Zhu Mingwei; He Jicheng
Favorite | View/Download：92/0 | Submit date：2021/02/02
MOLTEN STEEL FLOW FLUID-FLOW NUMERICAL-SIMULATION ELECTROMAGNETIC BRAKE MULTIPHASE FLOW ENTRAPMENT MECHANISM SPEED MODEL model experiment continuous casting mold low frequency traveling magnetic field resistance probe bubbles distribution |
| Current enhanced wettability of eutectic SnBi melt on Cu substrate 期刊论文
Materials Science and Technology, 2011, 卷号: 27, 期号: 3, 页码: 666-669
Authors: Q. G. Xu; X. B. Liu; H. F. Zhang
Adobe PDF(271Kb) | Favorite | View/Download：53/0 | Submit date：2012/04/13
Wetting Electromigration Alloys Interfacial Reaction Field |
| In situ observations on shear and creep-fatigue fracture behaviors of SnBi/Cu solder joints 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 528, 期号: 6, 页码: 2686-2693
Authors: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2037Kb) | Favorite | View/Download：57/0 | Submit date：2012/04/13
In Situ Observation Shear Creep-fatigue Fracture Sn-58bi Solder Grain-boundary Sliding Lead-free Solders Sn-bi Microstructure Evolution Tensile Properties Alloys Deformation Technology Metals Ag |
| Interfacial Microstructure and Growth Kinetics of Intermetallic Compound Layers in Sn-4 wt.%Ag/Cu-X (X = Zn, Ag, Sn) Couples 期刊论文
Journal of Electronic Materials, 2011, 卷号: 40, 期号: 7, 页码: 1542-1548
Authors: H. F. Zou; Q. K. Zhang; Z. F. Zhang
Adobe PDF(520Kb) | Favorite | View/Download：56/0 | Submit date：2012/04/13
Cu(3)Sn Void Cu Alloys Intermetallic Compound (Imc) Interfacial Reaction Free Solders Mechanisms Diffusion Strength Joints |
| Effect of Alloy Insert on Channel Segregation During Solidification of Sn-10 wt pct Bi Alloy 期刊论文
Metallurgical and Materials Transactions B-Process Metallurgy and Materials Processing Science, 2011, 卷号: 42, 期号: 1, 页码: 210-223
Authors: D. R. Liu; B. G. Sang; X. H. Kang; D. Z. Li
Adobe PDF(1537Kb) | Favorite | View/Download：63/0 | Submit date：2012/04/13
Nickel-base Superalloy Pb-sn Alloys Directional Solidification Melting Behavior Macrosegregation Ingots Convection Scheme Models Liquid |
| Oscillation Characteristics of Molten Metal Free Surface Under Compound Magnetic Field 期刊论文
JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2011, 卷号: 18, 期号: 5, 页码: 25-+
Authors: Deng Anyuan; Wang Engang; Xu Yongyi; Zhang Xingwu; He Jicheng
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ROUND BILLET SHAPE continuous casting compound magnetic field free surface fluctuation |
| Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376
Authors: Q. K. Zhang; Q. S. Zhu; H. F. Zou; Z. F. Zhang
Adobe PDF(2369Kb) | Favorite | View/Download：76/0 | Submit date：2012/04/13
Lead-free Solder Fatigue Fracture Interface Strain Localization Vertical Cracks Lead-free Solders Pb-free Solders Deformation-behavior Joints Tensile Cu Embrittlement Temperature Sn-3.5ag Alloy |
