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Electrospun carbon nanofibers/electrocatalyst hybrids as asymmetric electrodes for vanadium redox flow battery 期刊论文
Journal of Power Sources, 2015, 卷号: 281, 页码: 1-6
Authors:  G. J.;  Fan Wei, X. Z.;  Liu, J. G.;  Yan, C. W.
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Theoretical Investigations of the Knight Shifts and the Hyperfine Structure Constants for the Tetragonal Cu2+ Sites in the Bismuth- and Thallium-Based High-T-c Superconductors 期刊论文
Zeitschrift Fur Naturforschung Section a-a Journal of Physical Sciences, 2013, 卷号: 68, 期号: 6-7, 页码: 442-446
Authors:  M. Q. Kuang;  S. Y. Wu;  X. F. Hu;  B. T. Song
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Multiferroic and magnetoelectric properties of single-phase Bi(0.85)La(0.1)Ho(0.05)FeO(3) ceramics 期刊论文
Journal of Alloys and Compounds, 2011, 卷号: 509, 期号: 19, 页码: 5908-5912
Authors:  X. Q. Zhang;  Y. Sui;  X. J. Wang;  J. H. Mao;  R. B. Zhu;  Y. Wang;  Z. Wang;  Y. Q. Liu;  W. F. Liu
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Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining 期刊论文
Journal of Materials Science & Technology, 2011, 卷号: 27, 期号: 11, 页码: 1072-1076
Authors:  X. F. Zhang;  H. Y. Liu;  J. D. Guo;  J. K. Shang
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Influences of Substrate Alloying and Reflow Temperature on Bi Segregation Behaviors at Sn-Bi/Cu Interface 期刊论文
Journal of Electronic Materials, 2011, 卷号: 40, 期号: 11, 页码: 2320-2328
Authors:  Q. K. Zhang;  H. F. Zou;  Z. F. Zhang
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AlNiYCo Amorphous Matrix Composites Induced by Bismuth and Lead Additions 期刊论文
Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science, 2011, 卷号: 42A, 期号: 13, 页码: 4100-4105
Authors:  J. He;  H. X. Jiang;  J. Z. Zhao;  N. Mattern;  J. Eckert
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Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect 期刊论文
Journal of Alloys and Compounds, 2011, 卷号: 509, 期号: 5, 页码: 1785-1789
Authors:  T. Y. Kang;  Y. Y. Xiu;  C. Z. Liu;  L. Hui;  J. J. Wang;  W. P. Tong
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Theoretical elastic stiffness, structural stability and thermal conductivity of La(2)T(2)O(7) (T = Ge, Ti, Sn, Zr, Hf) pyrochlore 期刊论文
Acta Materialia, 2010, 卷号: 58, 期号: 13, 页码: 4369-4377
Authors:  B. Liu;  J. Y. Wang;  F. Z. Li;  Y. C. Zhou
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First-principles Investigation of Bi Segregation at the Solder Interface of Cu/Cu(3)Sn(010) 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1057-1062
Authors:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
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Layered Machinable and Electrically Conductive Ti(2)AlC and Ti(3)AlC(2) Ceramics: a Review 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 5, 页码: 385-416
Authors:  X. H. Wang;  Y. C. Zhou
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