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Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor 期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11
Authors:  Wei, Xiang-Fu;  Zhu, Qing-Sheng;  Guo, Jing-Dong;  Shang, Jian-Ku
Favorite  |  View/Download：64/0  |  Submit date：2021/11/22
Copper electroplating  Throwing power (TP)  Flexible printed circuit (FPC)  Suppressor  
Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3006-D3012
Authors:  Zhu, Q. S.;  Zhang, X.;  Liu, C. Z.;  Liu, H. Y.
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Microvia Filling by Copper Electroplating Using a Modified Safranine T as a Leveler 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2017, 卷号: 164, 期号: 9, 页码: D645-D651
Authors:  Zhu, H. P.;  Zhu, Q. S.;  Zhang, X.;  Liu, C. Z.;  Wang, J. J.
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Copper Bottom-up Filling for Through Silicon Via (TSV) Using Single JGB Additive 期刊论文
ECS ELECTROCHEMISTRY LETTERS, 2015, 卷号: 4, 期号: 9, 页码: D28-D30
Authors:  Tang, J.;  Zhu, Q. S.;  Zhang, Y.;  Zhang, X.;  Guo, J. D.;  Shang, J. K.;  qszhu@imr.ac.cn
Favorite  |  View/Download：94/0  |  Submit date：2016/04/21
Study on lotus-type porous copper electroplated with a Ni coating on inner surface of pores 期刊论文
Applied Surface Science, 2013, 卷号: 264, 页码: 772-778
Authors:  H. Du;  G. H. Song;  H. Nakajima;  Y. H. Zhao;  J. Q. Xiao;  T. Y. Xiong
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Lotus-type Porous Copper  Coating  Inner Surface Of Pore  Mechanical  Properties  Unidirectional Solidification  Aluminum Foams  Fabrication  Strength  Steel  
Fe-Ni新型UBM材料的电镀工艺开发及CSP封装可靠性研究 学位论文
, 北京: 中国科学院金属研究所, 2012
Authors:  张昊
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Fe-ni合金  Ubm  电镀  Csp封装  可靠性  Fe-ni Alloy  Electroplating  Ubm  Csp Packaging  Reliability  
Porous polymer supported palladium catalyst for cross coupling reactions with high activity and recyclability 期刊论文
Science China-Chemistry, 2012, 卷号: 55, 期号: 10, 页码: 2095-2103
Authors:  Q. Sun;  L. F. Zhu;  Z. H. Sun;  X. J. Meng;  F. S. Xiao
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Heterogenous Catalysis  Pd  Coupling Reactions  Nanoporous Polymers  Phase-transfer Catalysis  Heck Reaction  Heterogeneous Palladium  Aryl  Chlorides  Suzuki Reaction  Modified Zeolites  Activated Carbon  Ionic-liquid  Copper-free  Water  
Microstructures and Mechanical Properties of Al/Mg Alloy Multilayered Composites Produced by Accumulative Roll Bonding 期刊论文
Journal of Materials Science & Technology, 2011, 卷号: 27, 期号: 1, 页码: 15-21
Authors:  H. S. Liu;  B. Zhang;  G. P. Zhang
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Accumulative Roll Bonding (Arb)  Al/mg Alloy Multilayered Composite  Ultra-fine Grains  Hardness  Bending Properties  Severe Plastic-deformation  Arb Process  Cu-ag  Evolution  Strength  
Identifying the role of nanoscale heterogeneities in pitting behaviour of Al-based metallic glass 期刊论文
Corrosion Science, 2011, 卷号: 53, 期号: 9, 页码: 3007-3015
Authors:  S. D. Zhang;  Z. M. Wang;  X. C. Chang;  W. L. Hou;  J. Q. Wang
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Alloy  Aluminium  Polarization  Amorphous Structure  Pitting Corrosion  Passivity  Amorphous-nanocrystalline Alloys  Cooperative Stochastic-behavior  Solute-lean Nanocrystals  Localized Corrosion  Stainless-steel  Aluminum  Resistance  Chloride  Ce  Al87ni8.7y4.3  
Electrochemical fabrication of a porous nanostructured nickel hydroxide film electrode with superior pseudocapacitive performance 期刊论文
Journal of Alloys and Compounds, 2011, 卷号: 509, 期号: 18, 页码: 5611-5616
Authors:  D. S. Kong;  J. M. Wang;  H. B. Shao;  J. Q. Zhang;  C. N. Cao
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Nickel Hydroxide  Nanoporous Structure  Pseudocapacitive Performance  Dealloying  Electroplating  Electrochemical Capacitors  Nanoporous Nickel  Capacitors  Storage  Supercapacitor  Behavior  Nanoflakes  Deposition  Batteries  Alloys  Mno2