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Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
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Sn-Cu  microstructures  IMC  mechanical properties  
Effects of Sc and Zr microalloying on the microstructure and mechanical properties of high Cu content 7xxx Al alloy 期刊论文
INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS, 2019, 卷号: 26, 期号: 12, 页码: 1559-1569
Authors:  Liu, Chong-yu;  Teng, Guang-biao;  Ma, Zong-yi;  Wei, Li-li;  Zhang, Bing;  Chen, Yong
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aluminum alloys  microstructural evolution  mechanical property  grain refinement  
Highly efficient base-free aerobic oxidation of alcohols over gold nanoparticles supported on ZnO-CuO mixed oxides 期刊论文
CHINESE JOURNAL OF CATALYSIS, 2019, 卷号: 40, 期号: 12, 页码: 1924-1933
Authors:  Wang, Wei;  Xie, Yan;  Zhang, Shaohua;  Liu, Xing;  Zhang, Liyun;  Zhang, Bingsen;  Haruta, Masatake;  Huang, Jiahui
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Gold catalysis  ZnO-CuO mixed oxides  Alcohols  Aerobic oxidation  Base-free reaction  
Hot Deformation Behavior and Processing Map of a Cu-Bearing 2205 Duplex Stainless Steel 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 12, 页码: 1537-1548
Authors:  Xi, Tong;  Yin, Lu;  Yang, Chun-Guang;  Yang, Ke
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Cu-bearing duplex stainless steel  Hot deformation  Processing map  Dynamic recrystallization  Dynamic recovery  
Strengthening Ti-based bulk metallic glass composites containing phase transformable beta-Ti via Al addition 期刊论文
SCRIPTA MATERIALIA, 2019, 卷号: 173, 页码: 11-15
Authors:  Zhang, Jinhao;  Zhang, Long;  Zhang, Hongwei;  Fu, Huameng;  Li, Hong;  Zhang, Haifeng
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Bulk metallic glass composites  Strengthening  Phase transformation  Metastability  Yield strength  
Biofilm inhibition and corrosion resistance of 2205-Cu duplex stainless steel against acid producing bacterium Acetobacter aceti 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 11, 页码: 2494-2502
Authors:  Liu, Dan;  Jia, Ru;  Xu, Dake;  Yang, Hongying;  Zhao, Ying;  Khan, M. Saleem;  Huang, Songtao;  Wen, Jiankang;  Yang, Ke;  Gu, Tingyue
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Duplex stainless steel  Acid producing bacteria  Microbiologically influenced corrosion  Pitting corrosion  
Osteogenesis stimulation by copper-containing 316L stainless steel via activation of akt cell signaling pathway and Runx2 upregulation 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 11, 页码: 2727-2733
Authors:  Yuan, Yonghui;  Jin, Shujing;  Qi, Xun;  Chen, Xudong;  Zhang, Wei;  Yang, Ke;  Zhong, Hongshan
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Osteogenesis  Cu addition  Stainless steel  Cell signaling pathway  Bone  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
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Optimization of annealing treatment and comprehensive properties of Cu-containing Ti6Al4V-xCu alloys 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 10, 页码: 2121-2131
Authors:  Peng, Cong;  Liu, Yang;  Liu, Hui;  Zhang, Shuyuan;  Bai, Chunguang;  Wan, Yizao;  Ren, Ling;  Yang, Ke
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Cu-containing Ti6Al4V-xCu alloys  Annealing treatment  High Cu content  Comprehensive properties  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
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62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling