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Plastic deformation induced formation of supersaturated solid solution nanostructure in a dual-phase Cu-Ag alloy 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2022, 卷号: 903, 页码: 6
Authors:  Han, Z. X.;  Han, Z.;  Luo, Z. P.;  Wang, Z. B.
Favorite  |  View/Download：53/0  |  Submit date：2022/07/01
Dual-phase Cu alloy  Surface mechanical grinding treatment  Gradient nanostructured  Chemical mixing  Supersaturated solid solution  
Effect of La addition on Ag-rich phase formation and mechanical properties of Cu-2Ag alloys 期刊论文
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2022, 卷号: 18, 页码: 998-1008
Authors:  Hu, Peng-Hong;  Zhang, Shi-Hong;  Chen, Shuai-Feng;  Chen, Yan;  Song, Hong-Wu
Favorite  |  View/Download：101/0  |  Submit date：2022/07/14
Copper alloy  Rare earth  Ag-rich phase  Strength  Electrical conductivity  
Mechanisms for refining precipitation and improving strengthening of annealed Cu-2Ag alloy via La modification 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 883, 页码: 13
Authors:  Hu, Peng-Hong;  Song, Hong-Wu;  Chen, Yan;  Chen, Fei-Peng;  Zhang, Shi-Hong
Favorite  |  View/Download：137/0  |  Submit date：2021/10/15
Cu-Ag-La  Recrystallization  Precipitation strengthening  Grain refinement  Rare earth  
Effects of pressure on the generalized stacking fault energy and twinning propensity of face-centered cubic metals 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 866, 页码: 12
Authors:  Yan, J. X.;  Zhang, Z. J.;  Yu, H.;  Li, K. Q.;  Hu, Q. M.;  Yang, J. B.;  Zhang, Z. F.
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Molecular dynamics simulations  First-principles calculations  High-pressure  High entropy alloy  Twinning  Phase transitions  
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
Authors:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
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A low-to-high friction transition in gradient nano-grained Cu and Cu-Ag alloys 期刊论文
FRICTION, 2020, 页码: 10
Authors:  Chen, Xiang;  Han, Zhong
Favorite  |  View/Download：195/0  |  Submit date：2021/02/02
gradient nano-grained metals  Cu and Cu-Ag alloy  low-to-high friction transition  subsurface plastic deformation  wear  
Predicting the variation of stacking fault energy for binary Cu alloys by first-principles calculations 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 53, 页码: 61-65
Authors:  Cai, T.;  Li, K. Q.;  Zhang, Z. J.;  Zhang, P.;  Liu, R.;  Yang, J. B.;  Zhang, Z. F.
Favorite  |  View/Download：98/0  |  Submit date：2021/02/02
Cu-alloy  Deformation behavior  First-principles calculation  Stacking fault energy  
Two-stage Hall-Petch relationship in Cu with recrystallized structure 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 48, 页码: 31-35
Authors:  Tian, Y. Z.;  Ren, Y. P.;  Gao, S.;  Zheng, R. X.;  Wang, J. H.;  Pan, H. C.;  Zhang, Z. F.;  Tsuji, N.;  Qin, G. W.
Favorite  |  View/Download：97/0  |  Submit date：2021/02/02
Cu  Yield strength  Hall-Petch relationship  Ultrafine grain  Recrystallization  
Two-stage Hall-Petch relationship in Cu with recrystallized structure 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 48, 页码: 31-35
Authors:  Tian, Y. Z.;  Ren, Y. P.;  Gao, S.;  Zheng, R. X.;  Wang, J. H.;  Pan, H. C.;  Zhang, Z. F.;  Tsuji, N.;  Qin, G. W.
Favorite  |  View/Download：80/0  |  Submit date：2021/02/02
Cu  Yield strength  Hall-Petch relationship  Ultrafine grain  Recrystallization  
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
Authors:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
Favorite  |  View/Download：190/0  |  Submit date：2021/02/02
alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength