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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
Authors:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
Favorite  |  View/Download:6/0  |  Submit date:2018/12/25
Fe-Ni under bump metallization (UBM)  Intermetallic compounds (IMCs)  Electromigration (EM)  Diffusion  Vacancy formation  
The reliability of copper pillar under the coupling of thermal cycling and electric current stressing 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2016, 卷号: 27, 期号: 9, 页码: 9748-9754
Authors:  Ma, HC;  Guo, JD;  Chen, JQ;  Wu, D;  Liu, ZQ;  Zhu, QS;  Zhang, L;  Guo, HY;  Guo, JD (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.
Favorite  |  View/Download:48/0  |  Submit date:2016/12/28
Reliability and failure mechanism of copper pillar joints under current stressing 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2015, 卷号: 26, 期号: 10, 页码: 7690-7697
Authors:  Ma, Hui-Cai;  Guo, Jing-Dong;  Chen, Jian-Qiang;  Wu, Di;  Liu, Zhi-Quan;  Zhu, Qing-Sheng;  Shang, Jian Ku;  Zhang, Li;  Guo, Hong-Yan;  jdguo@imr.ac.cn;  jkshang@imr.ac.cn
Favorite  |  View/Download:64/0  |  Submit date:2016/04/21
Frequency-dependent failure mechanisms of nanocrystalline gold interconnect lines under general alternating current 期刊论文
Journal of Applied Physics, 2014, 卷号: 116, 期号: 10
Authors:  X. M. Luo;  B. Zhang;  G. P. Zhang
Favorite  |  View/Download:96/0  |  Submit date:2015/01/14
Molecular-dynamics Simulation  Fine-grained Materials  Thermal Fatigue  Damage  Deformation-behavior  Cu Interconnects  Current Stress  Electromigration  Films  Technology  Diffusion  
Inhibition of Electromigration in Eutectic SnBi Solder Interconnect by Plastic Prestraining 期刊论文
Journal of Materials Science & Technology, 2011, 卷号: 27, 期号: 11, 页码: 1072-1076
Authors:  X. F. Zhang;  H. Y. Liu;  J. D. Guo;  J. K. Shang
Adobe PDF(850Kb)  |  Favorite  |  View/Download:387/124  |  Submit date:2012/04/13
Electromigration  Interfacial Segregation  Prestrain  Dislocation  Vacancy  Electric-current  Segregation  Bi  
Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn-3Cu/Cu single crystal joints 期刊论文
Microelectronic Engineering, 2010, 卷号: 87, 期号: 4, 页码: 601-609
Authors:  H. F. Zou;  Z. F. Zhang
Adobe PDF(1205Kb)  |  Favorite  |  View/Download:435/217  |  Submit date:2012/04/13
Sn-cu Solder  Interfacial Strength  Intermetallic Compounds  Ductile-to-brittle Transition  Strain Rate  Fracture  Lead-free Solders  Intermetallic Compounds  Tensile Properties  Microstructure  Growth  Alloy  
Effects of Current Stressing on Shear Properties of Sn-3.8Ag-0.7Cu Solder Joints 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 8, 页码: 737-742
Authors:  X. J. Wang;  Q. L. Zeng;  Q. S. Zhu;  Z. G. Wang;  J. K. Shang
Adobe PDF(966Kb)  |  Favorite  |  View/Download:384/143  |  Submit date:2012/04/13
Strength  Fracture Strain  Voids  Solder  Al Interconnects  Electromigration  Growth  Lines  Sn  
Evaluation of thermal fatigue damage of 200-nm-thick Au interconnect lines 期刊论文
Scripta Materialia, 2009, 卷号: 60, 期号: 9, 页码: 803-806
Authors:  M. Wang;  B. Zhang;  G. P. Zhang;  C. S. Liu
Adobe PDF(255Kb)  |  Favorite  |  View/Download:324/134  |  Submit date:2012/04/13
Au Film  Thermal Fatigue  Alternating Current  Thin Copper-films  Cycle Fatigue  Behavior  Size  
Electric Current-induced Failure of 200-nm-thick Gold Interconnects 期刊论文
Journal of Materials Science & Technology, 2008, 卷号: 24, 期号: 6, 页码: 895-898
Authors:  B. Zhang;  Q. Y. Yu;  J. Tan;  G. P. Zhang
Adobe PDF(851Kb)  |  Favorite  |  View/Download:290/101  |  Submit date:2012/04/13
Au Interconnect  Electric Current  Thermal Fatigue  Failure  Thin Copper-films  Bamboo Al  Electromigration  Mechanisms  Damage  
Polarization fatigue resistance of Ca-doped Pb(Zr0.52Ti0.48)O-3 thin films prepared by the sol-gel method 期刊论文
Applied Physics a-Materials Science & Processing, 2008, 卷号: 90, 期号: 1, 页码: 185-189
Authors:  T. Wei;  Y. Wang;  C. Zhu;  X. W. Dong;  Y. D. Xia;  J. S. Zhu;  J. M. Liu
Adobe PDF(556Kb)  |  Favorite  |  View/Download:366/144  |  Submit date:2012/04/13
Ferroelectric Fatigue  Electrical-properties  o Heterostructures  Capacitors  Electrodes  Catio3