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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
Authors:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
Favorite  |  View/Download:6/0  |  Submit date:2018/12/25
Fe-Ni under bump metallization (UBM)  Intermetallic compounds (IMCs)  Electromigration (EM)  Diffusion  Vacancy formation  
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
Authors:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
Favorite  |  View/Download:25/0  |  Submit date:2018/06/05
Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Authors:  Gao, Li-Yin;  Liu, Zhi-Quan;  Li, Cai-Fu;  Liu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
Favorite  |  View/Download:62/0  |  Submit date:2017/08/17
Fe-ni Under Bump Metallization (Ubm)  Thermal Cycling  Microstructural Evolution  Lifetime  Recrystallization  Electron Backscatter Diffraction (Ebsd)  
Effect of Fe Content on the Interfacial Reliability of SnAgCu/Fe-Ni Solder Joints 期刊论文
Journal of Materials Science & Technology, 2014, 卷号: 30, 期号: 9, 页码: 928-933
Authors:  H. Zhang;  Q. S. Zhu;  Z. Q. Liu;  L. Zhang;  H. Y. Guo;  C. M. Lai
Favorite  |  View/Download:120/0  |  Submit date:2015/01/14
Fe-ni Alloy  Under Bump Metallization (Ubm)  Intermetallic Compound  (Imc)  Reliability  High Temperature Storage  Temperature Cycling  Lead-free Solders  Intermetallic Compounds  Growth-kinetics  Cu  Metallization  Ag  Strength  Ball  Ubm  
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint 期刊论文
Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12
Authors:  H. F. Zhou;  J. D. Guo;  Q. S. Zhu;  J. K. Shang
Favorite  |  View/Download:117/0  |  Submit date:2013/12/24
Under-bump Metallization (Ubm)  Electroless Fe-42ni(p)  Sn  Solderability  Interfacial Reaction  Fe-p  Solderability  Deposition  Alloys  Sn  Behavior  Systems  Surface  Cu  
Fe-Ni新型UBM材料的电镀工艺开发及CSP封装可靠性研究 学位论文
, 北京: 中国科学院金属研究所, 2012
Authors:  张昊
Favorite  |  View/Download:244/0  |  Submit date:2013/04/12
Fe-ni合金  Ubm  电镀  Csp封装  可靠性  Fe-ni Alloy  Electroplating  Ubm  Csp Packaging  Reliability  
FeNiP化学镀层的制备及其与无铅焊料的润湿性及界面反应性能 学位论文
, 北京: 中国科学院金属研究所, 2012
Authors:  周海飞
Favorite  |  View/Download:145/0  |  Submit date:2013/04/12
无铅焊料  凸点下金属化层  Fenip化学镀层  可焊性  界面反应  Lead-free Solder  Under Bump Metallization  Electroless Fenip  Solderability  Solder Reactions  
Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM 期刊论文
Advanced Engineering Materials, 2010, 卷号: 12, 期号: 6, 页码: 497-503
Authors:  Q. S. Zhu;  J. J. Guo;  P. J. Shang;  Z. G. Wang;  J. K. Shang
Adobe PDF(1514Kb)  |  Favorite  |  View/Download:450/178  |  Submit date:2012/04/13
p Alloy Film  Sn-ag Solder  Phosphorus Concentration  Joints  Strength  Chip  Metallization  Interconnect  Segregation  Technology  
电场与热场下无铅焊料的界面反应 学位论文
, 金属研究所: 中国科学院金属研究所, 2009
Authors:  张新房
Favorite  |  View/Download:309/0  |  Submit date:2012/04/10
无铅焊料  共晶snzn焊料  电迁移  反常极性效应  界面相变  预应变  界面反应  电镀feni  
Growth kinetics of intermetallic compounds between Sn-9Zn solder and electroplated Fe-42Ni metallization 期刊论文
Journal of Alloys and Compounds, 2009, 卷号: 487, 期号: 1-2, 页码: 776-780
Authors:  X. F. Zhang;  J. D. Guo;  J. K. Shang
Adobe PDF(759Kb)  |  Favorite  |  View/Download:478/246  |  Submit date:2012/04/13
Intermetallics  Kinetics  Interfacial Reactions  Feni  Activation Energy  Zn Based Solders  Ni-p/au Layer  Interfacial Reactions  Sn-ag  Cu  Electromigration  Interconnect  Microstructure  Substrate  Alloys