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The non-dendritic microstructure arising from grain boundary formation and wetting: A phase-field simulation and experimental investigation of semi-solid deformation 期刊论文
MATERIALS & DESIGN, 2022, 卷号: 223, 页码: 12
Authors:  Ren, Jian-kun;  Sun, Ming-yue;  Chen, Yun;  Xu, Bin;  Liu, Wei-feng;  Jiang, Hai -yang;  Cao, Yan-fei;  Li, Dian-zhong
Favorite  |  View/Download：22/0  |  Submit date：2023/05/09
Phase -field method  Semi -solid deformation  Grain boundary wetting  Non-dendritic microstructure  
The non-dendritic microstructure arising from grain boundary formation and wetting: A phase-field simulation and experimental investigation of semi-solid deformation 期刊论文
MATERIALS & DESIGN, 2022, 卷号: 223, 页码: 12
Authors:  Ren, Jian-kun;  Sun, Ming-yue;  Chen, Yun;  Xu, Bin;  Liu, Wei-feng;  Jiang, Hai -yang;  Cao, Yan-fei;  Li, Dian-zhong
Favorite  |  View/Download：16/0  |  Submit date：2023/05/09
Phase -field method  Semi -solid deformation  Grain boundary wetting  Non-dendritic microstructure  
A phase-field simulation of the solidification process under compression 期刊论文
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2021, 卷号: 13, 页码: 2210-2219
Authors:  Ren, Jian-kun;  Chen, Yun;  Cao, Yan-fei;  Xu, Bin;  Sun, Ming-yue;  Li, Dian-zhong
Favorite  |  View/Download：119/0  |  Submit date：2021/10/15
Phase-field simulation  Semi-solid deformation  Solidification  Dendrite  
Phase Field Modeling of Formation Mechanism of Grain Boundary Allotriomorph in beta ->alpha Phase Transformation in Ti-6Al-4V Alloy 期刊论文
ACTA METALLURGICA SINICA, 2020, 卷号: 56, 期号: 8, 页码: 1113-1122
Authors:  Sun Jia;  Li Xuexiong;  Zhang Jinhu;  Wang Gang;  Yang Mei;  Wang Hao;  Xu Dongsheng
Favorite  |  View/Download：104/0  |  Submit date：2021/02/02
Ti-6Al-4V  phase field model  thermal noise term  alpha(GB)  grain boundary wetting  
Fabrication of Al-35Zn alloys with excellent damping capacity and mechanical properties 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2017, 卷号: 722, 页码: 138-144
Authors:  Jiang, H. J.;  Liu, C. Y.;  Ma, Z. Y.;  Zhang, X.;  Yu, L.;  Ma, M. Z.;  Liu, R. P.;  Liu, CY (reprint author), Guilin Univ Technol, Minist Educ, Key Lab New Proc Technol Nonferrous Met & Mat, Guilin 541004, Peoples R China.;  Ma, ZY (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, 72 Wenhua Rd, Shenyang 110016, Peoples R China.
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Al Alloy  Rolling  Damping Capacity  Mechanical Properties  
Characteristics of Resistance Welding Magnesium Alloys AZ31 and AZ91 期刊论文
WELDING JOURNAL, 2011, 卷号: 90, 期号: 12, 页码: 249S-257S
Authors:  Luo, H.;  Hao, C.;  Zhang, J.;  Gan, Z.;  Chen, H.;  Zhang, H.
Favorite  |  View/Download：68/0  |  Submit date：2021/02/02
Resistance Spot Welding  Mg Alloys  Cracking  Expulsion  Grain Boundary Wetting  
Microstructure evolution of Zr(2)Al(3)C(4) in Cu matrix 期刊论文
Journal of Materials Research, 2011, 卷号: 26, 期号: 3, 页码: 372-383
Authors:  J. Zhang;  J. Y. Wang;  Y. C. Zhou
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Metal-ceramic Interfaces  Thermal-expansion  Crystal-structure  Part i  X-ray  Composites  Copper  Ti3alc2  Al  Temperature  
Composition and orientation dependence of the interfacial energy in Fe-Cr stainless steel alloys 期刊论文
Physica Status Solidi B-Basic Solid State Physics, 2011, 卷号: 248, 期号: 9, 页码: 2087-2090
Authors:  S. Lu;  Q. M. Hu;  B. Johansson;  L. Vitos
Adobe PDF(401Kb)  |  Favorite  |  View/Download：94/0  |  Submit date：2012/04/13
Anisotropy  Interfacial Energy  Stainless Steels  Ab Initio  Spinodal Decomposition  Surface-energy  Potential Model  3d Metals  Ab-initio  System  Approximation  Magnetism  
In-situ observations on fracture behaviors of Cu-Sn IMC layers induced by deformation of Cu substrates 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2011, 卷号: 530, 页码: 452-461
Authors:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(1086Kb)  |  Favorite  |  View/Download：97/0  |  Submit date：2012/04/13
In-situ Observation  Intermetallic Compounds  Interface  Fracture  Dislocation Pile-up  Cumulative Stress  Lead-free Solders  Intermetallic Compounds  Mechanical-properties  Fatigue Damage  Joints  Sn-3.5ag  Polycrystalline  Interfaces  Morphology  Evolution  
In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
Authors:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(2667Kb)  |  Favorite  |  View/Download：63/0  |  Submit date：2012/04/13
Snag/cu Solder Joints  Creep Fatigue  In Situ Observation  Strain  Localization  Grain Subdivision  Lead-free Solders  Pb-sn Solder  Tensile Properties  Shear-strength  Deformation-behavior  Sn-3.5ag Solder  Strain-rate  Ag  Microstructure  Alloys