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High-quality dissimilar friction stir welding of Al to steel with no contacting between tool and steel plate 期刊论文
MATERIALS CHARACTERIZATION, 2022, 卷号: 191, 页码: 7
Authors:  Zhang, M.;  Wang, Y. D.;  Xue, P.;  Zhang, H.;  Ni, D. R.;  Wang, K. S.;  Ma, Z. Y.
Favorite  |  View/Download:5/0  |  Submit date:2022/09/16
Friction stir welding  Dissimilar joint  Thickness difference  Interface  Intermetallic compound  
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
Authors:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
Favorite  |  View/Download:9/0  |  Submit date:2022/07/01
Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn  
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
Authors:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
Favorite  |  View/Download:23/0  |  Submit date:2022/01/27
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
Authors:  Liu, C. Z.;  Wang, J. J.;  Zhu, M. W.;  Liu, X. M.;  Lu, T. N.;  Yang, J. R.
Favorite  |  View/Download:42/0  |  Submit date:2021/02/03
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
Authors:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
Favorite  |  View/Download:39/0  |  Submit date:2021/03/15
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
Authors:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin;  Xiong, Xiaodong
Favorite  |  View/Download:71/0  |  Submit date:2021/02/02
Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism  
The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
Authors:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan
Favorite  |  View/Download:37/0  |  Submit date:2021/02/02
AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
Authors:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
Favorite  |  View/Download:34/0  |  Submit date:2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
Authors:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
Favorite  |  View/Download:36/0  |  Submit date:2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
Authors:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
Favorite  |  View/Download:68/0  |  Submit date:2021/02/03