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Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
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Lead-free solder  reliability  IMC  crack  failure  
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
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Sn-Cu  microstructures  IMC  mechanical properties  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
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Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
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62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
Authors:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
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Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 1, 页码: 862-866
Authors:  Yang, Haokun;  Cao, Ke;  Zhao, XiaoTian;  Liu, Wei;  Lu, Jian;  Lu, Yang
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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
Authors:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
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Fe-Ni under bump metallization (UBM)  Intermetallic compounds (IMCs)  Electromigration (EM)  Diffusion  Vacancy formation  
Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing 期刊论文
CORROSION SCIENCE, 2018, 卷号: 139, 页码: 383-394
Authors:  Wang, J;  Chen, G;  Sun, FL;  Zhou, ZX;  Liu, ZQ;  Liu, CQ
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Electronic materials  Intermetallics  Metal coatings  Tin  STEM  Oxidation  
Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
Authors:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR;  Suganuma, K;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.;  Zhang, H (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
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Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth  
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
Authors:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
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Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength