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High-Throughput Fabrication of Flexible and Transparent All-Carbon Nanotube Electronics 期刊论文
ADVANCED SCIENCE, 2018, 卷号: 5, 期号: 5, 页码: -
Authors:  Chen, YY;  Sun, Y;  Zhu, QB;  Wang, BW;  Yan, X;  Qiu, S;  Li, QW;  Hou, PX;  Liu, C;  Sun, DM;  Cheng, HM
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Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces 期刊论文
ACTA MATERIALIA, 2016, 卷号: 104, 页码: 1-8
Authors:  Zhang, Z. H.;  Li, M. Y.;  Liu, Z. Q.;  Yang, S. H.;;
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Double-Balanced Graphene Integrated Mixer with Outstanding Linearity 期刊论文
NANO LETTERS, 2015, 卷号: 15, 期号: 10, 页码: 6677-6682
Authors:  Lyu, Hongming;  Wu, Huaqiang;  Liu, Jinbiao;  Lu, Qi;  Zhang, Jinyu;  Wu, Xiaoming;  Li, Junfeng;  Ma, Teng;  Niu, Jiebin;  Ren, Wencai;  Cheng, Huiming;  Yu, Zhiping;  Qian, He;;
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Highly sensitive reversible light-driven switches based on LaSrAlO(4) single crystals 期刊论文
Optics Communications, 2011, 卷号: 284, 期号: 24, 页码: 5702-5704
Authors:  X. L. Han;  H. Ni;  K. Zhao;  W. F. Xiang
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Structural Surface Crack Monitoring Method Based on Electrical Potential Technique and Modern Surface Technology 期刊论文
Chinese Journal of Mechanical Engineering, 2011, 卷号: 24, 期号: 4, 页码: 601-606
Authors:  R. H. Cui;  Y. T. He;  Z. M. Yu;  H. P. Li;  W. J. Shu;  J. Q. Du
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Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing 期刊论文
Journal of Applied Physics, 2011, 卷号: 110, 期号: 1
Authors:  Q. K. Zhang;  J. Tan;  Z. F. Zhang
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Study of copper precipitation behavior in a Cu-bearing austenitic antibacterial stainless steel 期刊论文
Materials & Design, 2011, 卷号: 32, 期号: 4, 页码: 2374-2379
Authors:  L. Ren;  L. Nan;  K. Yang
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IrO(2)-SiO(2) binary oxide films: Geometric or kinetic interpretation of the improved electrocatalytic activity for the oxygen evolution reaction 期刊论文
International Journal of Hydrogen Energy, 2011, 卷号: 36, 期号: 9, 页码: 5218-5226
Authors:  J. J. Zhang;  J. M. Hu;  J. Q. Zhang;  C. N. Cao
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Contamination-free and damage-free patterning of single-walled carbon nanotube transparent conductive films on flexible substrates 期刊论文
Nanoscale, 2011, 卷号: 3, 期号: 11, 页码: 4571-4574
Authors:  Y. Su;  J. H. Du;  S. F. Pei;  C. Liu;  H. M. Cheng
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Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy 期刊论文
Journal of Materials Engineering and Performance, 2011, 卷号: 20, 期号: 3, 页码: 481-486
Authors:  X. H. Chen;  J. J. Mao
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