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High-Throughput Fabrication of Flexible and Transparent All-Carbon Nanotube Electronics 期刊论文
ADVANCED SCIENCE, 2018, 卷号: 5, 期号: 5, 页码: -
Authors:  Chen, YY;  Sun, Y;  Zhu, QB;  Wang, BW;  Yan, X;  Qiu, S;  Li, QW;  Hou, PX;  Liu, C;  Sun, DM;  Cheng, HM
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carbon nanotubes  flexible electronics  photosensitive dry films  thin-film transistors  transparent electronics  
Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)(Cu) and liquid-Sn0.7Cu/(001)(Cu) joint interfaces 期刊论文
ACTA MATERIALIA, 2016, 卷号: 104, 页码: 1-8
Authors:  Zhang, Z. H.;  Li, M. Y.;  Liu, Z. Q.;  Yang, S. H.;;
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Intermetallic Compounds  Microstructure Formation Mechanism  Cu Single Crystal  Orientation  Soldering  
Double-Balanced Graphene Integrated Mixer with Outstanding Linearity 期刊论文
NANO LETTERS, 2015, 卷号: 15, 期号: 10, 页码: 6677-6682
Authors:  Lyu, Hongming;  Wu, Huaqiang;  Liu, Jinbiao;  Lu, Qi;  Zhang, Jinyu;  Wu, Xiaoming;  Li, Junfeng;  Ma, Teng;  Niu, Jiebin;  Ren, Wencai;  Cheng, Huiming;  Yu, Zhiping;  Qian, He;;
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Graphene  Mixer  Integrated Circuit  Re Electronics  
Highly sensitive reversible light-driven switches based on LaSrAlO(4) single crystals 期刊论文
Optics Communications, 2011, 卷号: 284, 期号: 24, 页码: 5702-5704
Authors:  X. L. Han;  H. Ni;  K. Zhao;  W. F. Xiang
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Photoswitch  Single Crystal  Photovoltage  Conical Intersection  Laalo3 Perovskite  Ceramics  Dynamics  Hybrids  
Structural Surface Crack Monitoring Method Based on Electrical Potential Technique and Modern Surface Technology 期刊论文
Chinese Journal of Mechanical Engineering, 2011, 卷号: 24, 期号: 4, 页码: 601-606
Authors:  R. H. Cui;  Y. T. He;  Z. M. Yu;  H. P. Li;  W. J. Shu;  J. Q. Du
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Crack Monitoring  Electrical Potential Technique  Surface Technology  Coating Sensor  Ly12-cz Aluminum Alloy  Growth  Damage  
Fracture behaviors and strength of Cu(6)Sn(5) intermetallic compounds by indentation testing 期刊论文
Journal of Applied Physics, 2011, 卷号: 110, 期号: 1
Authors:  Q. K. Zhang;  J. Tan;  Z. F. Zhang
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Lead-free Solders  Mechanical-properties  Interfacial Reactions  Deformation-behavior  Joints  Nanoindentation  Sn  Metallization  Toughness  Cu3sn  
Study of copper precipitation behavior in a Cu-bearing austenitic antibacterial stainless steel 期刊论文
Materials & Design, 2011, 卷号: 32, 期号: 4, 页码: 2374-2379
Authors:  L. Ren;  L. Nan;  K. Yang
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Electrical-conductivity  Corrosion-resistance  Thermoelectric-power  Alpha-iron  Alloy  
IrO(2)-SiO(2) binary oxide films: Geometric or kinetic interpretation of the improved electrocatalytic activity for the oxygen evolution reaction 期刊论文
International Journal of Hydrogen Energy, 2011, 卷号: 36, 期号: 9, 页码: 5218-5226
Authors:  J. J. Zhang;  J. M. Hu;  J. Q. Zhang;  C. N. Cao
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Iro(2) Electrode  Sio(2) Doping  Electrochemical Surface Structure  Electrocatalytic Activity  Electrochemical Surface Characterization  Pem Water Electrolysis  X-ray-diffraction  Iro2-based Electrodes  Cyclic Voltammetry  Alkaline-solution  Co3o4 Electrodes  Ruo2 Electrodes  Iridium Oxide  Acid-solution  
Contamination-free and damage-free patterning of single-walled carbon nanotube transparent conductive films on flexible substrates 期刊论文
Nanoscale, 2011, 卷号: 3, 期号: 11, 页码: 4571-4574
Authors:  Y. Su;  J. H. Du;  S. F. Pei;  C. Liu;  H. M. Cheng
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Thin-films  Transistors  Networks  
Thermal Stability and Tensile Properties of Electrodeposited Cu-Bi Alloy 期刊论文
Journal of Materials Engineering and Performance, 2011, 卷号: 20, 期号: 3, 页码: 481-486
Authors:  X. H. Chen;  J. J. Mao
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Grain Growth  Nanocrystalline Cu-bi  Segregation  Strength  Thermal  Stability  Nanocrystalline Copper  Segregation  Ni