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Study on the antibacterial mechanism of Cu-bearing titanium alloy in the view of materials science 期刊论文
MATERIALS TECHNOLOGY, 2019
Authors:  Ma, Zheng;  Liu, Rui;  Zhao, Ying;  Ren, Ling;  Yang, Ke
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Antibacterial mechanism  copper-containing titanium alloy  microstructures  Cu ion  
Site Occupation of Nb in gamma-TiAl: Beyond the Point Defect Gas Approximation 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 12, 页码: 1511-1520
Authors:  Diao, Wei;  Ye, Li-Hua;  Ji, Zong-Wei;  Yang, Rui;  Hu, Qing-Miao
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Site preference  Titanium aluminides  Special quasi-random structures  First principles method  
Evolution of a bicontinuous structure in peritectic melting: The simplest form of dealloying 期刊论文
PHYSICAL REVIEW MATERIALS, 2019, 卷号: 3, 期号: 11
Authors:  Hu, Wen-Kai;  Shao, Jun-Chao;  Wang, Shao-Gang;  Jin, Hai-Jun
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Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
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62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Phase stability of B2-ordered ZrTiHfCuNiFe high entropy alloy 期刊论文
INTERMETALLICS, 2019, 卷号: 111
Authors:  Meng, Y. H.;  Duan, F. H.;  Pan, J.;  Li, Y.
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High entropy alloy  B2 structure  Amorphous  Phase stability  Sluggish diffusion  
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
Authors:  Du, Yahong;  Wen, Ming;  Ji, Hongjun;  Li, Mingyu;  Liu, Zhi-Quan
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Understanding the electrochemical behavior of bulk-synthesized MgZn2 intermetallic compound in aqueous NaCl solutions as a function of pH 期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2019, 卷号: 23, 期号: 4, 页码: 1165-1177
Authors:  Ikeuba, Alexander I.;  Kou, Fujun;  Duan, Haowei;  Zhang, Bo;  Wang, Jianqiu;  Han, En-Hou;  Ke, Wei
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MgZn2  Intermetallic compound  Corrosion  EIS  XPS  FIB-TEM  
Deformation induced twinning and phase transition in an interstitial intermetallic compound niobium boride 期刊论文
ACTA MATERIALIA, 2019, 卷号: 165, 页码: 459-470
Authors:  Jiang, Binbin;  Chen, Chunjin;  Wang, Xuelu;  Wang, Hao;  Wang, Weizhen;  Ye, Hengqiang;  Du, Kui
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Twinning  Phase transition  Stacking faults  Interstitial compound  Scanning transmission electron microscopy  
Exfoliation corrosion of extruded Mg-Li-Ca alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 9, 页码: 1550-1557
Authors:  Ding, ZY;  Cui, LY;  Zeng, RC;  Zhao, YB;  Guan, SK;  Xu, DK;  Lin, CG
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Magnesium-lithium alloy  Exfoliation corrosion  Intermetallic compound  Extrusion  Microstructure  
Combined effects of surface oxidation and interfacial intermetallic compound growth on solderability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing 期刊论文
CORROSION SCIENCE, 2018, 卷号: 139, 页码: 383-394
Authors:  Wang, J;  Chen, G;  Sun, FL;  Zhou, ZX;  Liu, ZQ;  Liu, CQ
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Electronic materials  Intermetallics  Metal coatings  Tin  STEM  Oxidation