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High-quality dissimilar friction stir welding of Al to steel with no contacting between tool and steel plate
期刊论文
MATERIALS CHARACTERIZATION, 2022, 卷号: 191, 页码: 7
Authors:
Zhang, M.
;
Wang, Y. D.
;
Xue, P.
;
Zhang, H.
;
Ni, D. R.
;
Wang, K. S.
;
Ma, Z. Y.
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View/Download:72/0
  |  
Submit date:2022/09/16
Friction stir welding
Dissimilar joint
Thickness difference
Interface
Intermetallic compound
Simple hexagonal structured gold with eight-coordination formed with ordered structural vacancies
期刊论文
ACTA MATERIALIA, 2022, 卷号: 229, 页码: 9
Authors:
Wang, Xuelu
;
Chen, Chunjin
;
Jiang, Binbin
;
Duan, Huichao
;
Du, Kui
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View/Download:43/0
  |  
Submit date:2022/07/14
Structure
Transmission electron microscopy
Vacancies
Phase transformation
Electrical conductivity
Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer
期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 4, 页码: 4484-4496
Authors:
Cheng, Qiang
;
Zheng, LiLi
;
Li, XiChao
;
Xu, Bin
;
Sun, MingYue
;
Shi, Jing
;
Dai, ZuoQiang
;
Zhang, TieZhu
;
Zhang, HongXin
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View/Download:33/0
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Submit date:2022/07/01
Solid diffusion bonding
Ti3SiC2 ceramic
SUS430
Interfacial microstructure
Growth kinetics
Study on the micro-interface behavior of 2024Al light alloy bonded by ultrasonic assisted solid phase diffusion welding with Ag interlayer under atmosphere
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2022, 卷号: 833, 页码: 10
Authors:
Wang, Qian
;
Nie, Yong
;
Shao, Yingfeng
;
Liu, Hongzhi
;
Hu, Xiaoqiang
;
Li, Dianzhong
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View/Download:32/0
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Submit date:2022/07/01
Ultrasound
Solid phase welding
Plastic deformation
Amorphous
Intermetallic compound
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
Authors:
Chen, Yinbo
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
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View/Download:39/0
  |  
Submit date:2022/07/01
Sn-Bi-Ag solder
Grain orientation
Temperature gradient
Aging
Ag3Sn
Discovery of a bulk C36-type MgZn2 structure step by step transformed from the C14 prototype laves phase structure
期刊论文
JOURNAL OF MATERIALS SCIENCE, 2022, 卷号: 57, 期号: 4, 页码: 2999-3009
Authors:
Yang, Tong
;
Lu, Jiangbo
;
Li, Kai
;
Kong, Yi
;
Zhang, Zhenjun
;
Long, Qianxin
;
Lan, Xinyue
;
Lu, Qiang
;
Du, Yong
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View/Download:38/0
  |  
Submit date:2022/07/01
Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints
期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
Authors:
Gao, Li-Yin
;
Luo, Yi-Xiu
;
Wan, Peng
;
Liu, Zhi-Quan
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View/Download:168/0
  |  
Submit date:2021/10/15
Solder joint
Intermetallic compound
Mechanical property
Nano-indentation
First principle calculation
Effect of Micro-Alloying Element La on Solidification Microstructure and Mechanical Properties of Hypoeutectic Al-Si Alloys
期刊论文
ACTA METALLURGICA SINICA, 2021, 卷号: 57, 期号: 1, 页码: 103-110
Authors:
Zheng Qiuju
;
Ye Zhongfei
;
Jiang Hongxiang
;
Lu Ming
;
Zhang Lili
;
Zhao Jiuzhou
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  |  
View/Download:50/0
  |  
Submit date:2021/10/15
Al-Si alloy
micro-alloying element La
solidification microstructure
mechanical property
Effect of Micro-Alloying Element La on Solidification Microstructure and Mechanical Properties of Hypoeutectic Al-Si Alloys
期刊论文
ACTA METALLURGICA SINICA, 2021, 卷号: 57, 期号: 1, 页码: 103-110
Authors:
Zheng Qiuju
;
Ye Zhongfei
;
Jiang Hongxiang
;
Lu Ming
;
Zhang Lili
;
Zhao Jiuzhou
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  |  
View/Download:71/0
  |  
Submit date:2021/10/15
Al-Si alloy
micro-alloying element La
solidification microstructure
mechanical property
Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262
Authors:
Liu, C. Z.
;
Wang, J. J.
;
Zhu, M. W.
;
Liu, X. M.
;
Lu, T. N.
;
Yang, J. R.
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View/Download:66/0
  |  
Submit date:2021/02/03