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Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
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Sn-Cu  microstructures  IMC  mechanical properties  
Effect of microgravity on the solidification of aluminum-bismuth-tin immiscible alloys 期刊论文
NPJ MICROGRAVITY, 2019, 卷号: 5
Authors:  Jiang, Hongxiang;  Li, Shixin;  Zhang, Lili;  He, Jie;  Zhao, Jiuzhou
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溅射沉积Mg_2(Sn,Si)薄膜组织结构与导电性能 期刊论文
金属学报, 2019, 卷号: 55, 期号: 11, 页码: 1469-1476
Authors:  宋贵宏;  李贵鹏;  刘倩男;  杜昊;  胡方
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Mg2(Sn,Si)薄膜  Mg含量  电导率  迁移率  XPS  
Hot compression deformation behavior of Mg-5Zn-3.5Sn-1Mn-0.5Ca-0.5Cu alloy 期刊论文
MATERIALS CHARACTERIZATION, 2019, 卷号: 157
Authors:  Wang, Cong;  Liu, Yunteng;  Lin, Tao;  Luo, Tianjiao;  Zhao, Yuhong;  Hou, Hua;  Yang, Yuansheng
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Mg-5Zn-3.5Sn-1Mn-0.5Ca-0.5Cu alloy  Hot compression  Processing map  Coarse particles  Microstructure evolution  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
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Giant Linear Magnetoresistance and Carrier Density Tunable Transport in Topological Crystalline Insulator SnTe Thin Film 期刊论文
PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS, 2019, 卷号: 256, 期号: 10
Authors:  Wei, Feng;  Gao, Xuan P. A.;  Ma, Song;  Zhang, Zhidong
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carrier density  giant linear magnetoresistance  SnTe  topological crystalline insulators  weak antilocalization  
铜导线高温拉伸组织与力学性能分析 期刊论文
合成材料老化与应用, 2019, 卷号: 48, 期号: 04, 页码: 87-90
Authors:  刘健;  张双楠;  蒋炜
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高温拉伸  断口形貌  金相组织  位错结构  
Effect of Al on the microstructure and mechanical properties of Mg-6Zn-2Sn-0.5Mn alloy 期刊论文
MATERIALS SCIENCE AND TECHNOLOGY, 2019, 卷号: 35, 期号: 12, 页码: 1464-1470
Authors:  Wang, Cong;  Cui, Jie;  Luo, Tianjiao;  Liu, Yunteng;  Wang, Changzheng;  Hao, Xuehui;  Yang, Yuansheng
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Mg-Zn-Sn alloy  Al addition  ageing treatment  mechanical properties  microstructure  grain refinement  precipitation  strengthening  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
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62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
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