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Influence of Al2O3 content on microstructure, electrical conductivity and adhesion strength of cold sprayed Al-Al2O3 coatings on PEEK substrate 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2022, 卷号: 446, 页码: 13
Authors:  Liu, Hanhui;  Tariq, Naeem ul Haq;  Ren, Yupeng;  Zhao, Lijia;  Yang, Ying;  Cui, Xinyu;  Wang, Jiqiang;  Xiong, Tianying
Favorite  |  View/Download:58/0  |  Submit date:2022/09/16
Cold spray  PEEK  Al-Al2O3 coating  Surface metallization  Electrical conductivity  Adhesion strength  
Effect of accelerating gas temperature on microstructure and properties of cold sprayed Al coating on polyether ether ketone (PEEK) 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2022, 卷号: 429, 页码: 11
Authors:  Liu, Hanhui;  Tariq, Naeem ul Haq;  Ren, Yupeng;  Luo, Jing;  Liu, Housheng;  Zhao, LiJia;  Cui, Xinyu;  Wang, Jiqiang;  Xiong, Tianying
Favorite  |  View/Download:58/0  |  Submit date:2022/01/27
Cold spray  PEEK  Accelerating gas temperature  Coating properties  Surface metallization  Deposition behavior  
Highly solderability of FeP film in contact with SnAgCu solder 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 818, 页码: 6
Authors:  Zhou, Haifei;  Guo, Jingdong;  Shang, Jianku;  Song, Xiaoning
Favorite  |  View/Download:59/0  |  Submit date:2021/02/02
Solderability  Electroless FeP  SnAgCu  Oxidation  
Investigation on enhancing the thermal conductance of gallium-based thermal interface materials using chromium-coated diamond particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 7, 页码: 7194-7202
Authors:  Wei, S.;  Yu, Z. F.;  Zhou, L. J.;  Guo, J. D.
Favorite  |  View/Download:66/0  |  Submit date:2021/02/02
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
Authors:  Xu Zhiwu;  Li Zhengwei;  Luo Xiaoyu;  Ji Shude;  Yan Jiuchun
Favorite  |  View/Download:62/0  |  Submit date:2021/02/02
ultrasonic soldering  spreading frontier  oxide film  finite element simulation  elimination measure  
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
Authors:  Xu Zhiwu;  Li Zhengwei;  Luo Xiaoyu;  Ji Shude;  Yan Jiuchun
Favorite  |  View/Download:54/0  |  Submit date:2021/02/02
ultrasonic soldering  spreading frontier  oxide film  finite element simulation  elimination measure  
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint 期刊论文
Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12
Authors:  H. F. Zhou;  J. D. Guo;  Q. S. Zhu;  J. K. Shang
Favorite  |  View/Download:68/0  |  Submit date:2013/12/24
Under-bump Metallization (Ubm)  Electroless Fe-42ni(p)  Sn  Solderability  Interfacial Reaction  Fe-p  Solderability  Deposition  Alloys  Sn  Behavior  Systems  Surface  Cu  
Fe-Ni新型UBM材料的电镀工艺开发及CSP封装可靠性研究 学位论文
, 北京: 中国科学院金属研究所, 2012
Authors:  张昊
Favorite  |  View/Download:57/0  |  Submit date:2013/04/12
Fe-ni合金  Ubm  电镀  Csp封装  可靠性  Fe-ni Alloy  Electroplating  Ubm  Csp Packaging  Reliability  
C/C和C/SiC复合材料与金属钎焊接头界面组织与性能研究 学位论文
, 北京: 中国科学院金属研究所, 2012
Authors:  沈元勋
Favorite  |  View/Download:97/0  |  Submit date:2013/04/12
复合材料  钎焊  中间层  显微组织  力学性能  残余应力  Composites  Brazing  Interlayer  Microstructure  Mechanical Properties  Residual Stress  
FeNiP化学镀层的制备及其与无铅焊料的润湿性及界面反应性能 学位论文
, 北京: 中国科学院金属研究所, 2012
Authors:  周海飞
Favorite  |  View/Download:116/0  |  Submit date:2013/04/12
无铅焊料  凸点下金属化层  Fenip化学镀层  可焊性  界面反应  Lead-free Solder  Under Bump Metallization  Electroless Fenip  Solderability  Solder Reactions