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Influence of Al2O3 content on microstructure, electrical conductivity and adhesion strength of cold sprayed Al-Al2O3 coatings on PEEK substrate
期刊论文
SURFACE & COATINGS TECHNOLOGY, 2022, 卷号: 446, 页码: 13
Authors:
Liu, Hanhui
;
Tariq, Naeem ul Haq
;
Ren, Yupeng
;
Zhao, Lijia
;
Yang, Ying
;
Cui, Xinyu
;
Wang, Jiqiang
;
Xiong, Tianying
Favorite
  |  
View/Download:58/0
  |  
Submit date:2022/09/16
Cold spray
PEEK
Al-Al2O3 coating
Surface metallization
Electrical conductivity
Adhesion strength
Effect of accelerating gas temperature on microstructure and properties of cold sprayed Al coating on polyether ether ketone (PEEK)
期刊论文
SURFACE & COATINGS TECHNOLOGY, 2022, 卷号: 429, 页码: 11
Authors:
Liu, Hanhui
;
Tariq, Naeem ul Haq
;
Ren, Yupeng
;
Luo, Jing
;
Liu, Housheng
;
Zhao, LiJia
;
Cui, Xinyu
;
Wang, Jiqiang
;
Xiong, Tianying
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  |  
Submit date:2022/01/27
Cold spray
PEEK
Accelerating gas temperature
Coating properties
Surface metallization
Deposition behavior
Highly solderability of FeP film in contact with SnAgCu solder
期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2020, 卷号: 818, 页码: 6
Authors:
Zhou, Haifei
;
Guo, Jingdong
;
Shang, Jianku
;
Song, Xiaoning
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View/Download:59/0
  |  
Submit date:2021/02/02
Solderability
Electroless FeP
SnAgCu
Oxidation
Investigation on enhancing the thermal conductance of gallium-based thermal interface materials using chromium-coated diamond particles
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 7, 页码: 7194-7202
Authors:
Wei, S.
;
Yu, Z. F.
;
Zhou, L. J.
;
Guo, J. D.
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  |  
Submit date:2021/02/02
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
Authors:
Xu Zhiwu
;
Li Zhengwei
;
Luo Xiaoyu
;
Ji Shude
;
Yan Jiuchun
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View/Download:62/0
  |  
Submit date:2021/02/02
ultrasonic soldering
spreading frontier
oxide film
finite element simulation
elimination measure
Oxidation Behavior at the Frontier of Ultrasonic-induced Solder Spreading on the Aluminum Alloy Surface
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 11, 页码: 3426-3432
Authors:
Xu Zhiwu
;
Li Zhengwei
;
Luo Xiaoyu
;
Ji Shude
;
Yan Jiuchun
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  |  
View/Download:54/0
  |  
Submit date:2021/02/02
ultrasonic soldering
spreading frontier
oxide film
finite element simulation
elimination measure
Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint
期刊论文
Journal of Materials Science & Technology, 2013, 卷号: 29, 期号: 1, 页码: 7-12
Authors:
H. F. Zhou
;
J. D. Guo
;
Q. S. Zhu
;
J. K. Shang
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  |  
View/Download:68/0
  |  
Submit date:2013/12/24
Under-bump Metallization (Ubm)
Electroless Fe-42ni(p)
Sn
Solderability
Interfacial Reaction
Fe-p
Solderability
Deposition
Alloys
Sn
Behavior
Systems
Surface
Cu
Fe-Ni新型UBM材料的电镀工艺开发及CSP封装可靠性研究
学位论文
, 北京: 中国科学院金属研究所, 2012
Authors:
张昊
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View/Download:57/0
  |  
Submit date:2013/04/12
Fe-ni合金
Ubm
电镀
Csp封装
可靠性
Fe-ni Alloy
Electroplating
Ubm
Csp Packaging
Reliability
C/C和C/SiC复合材料与金属钎焊接头界面组织与性能研究
学位论文
, 北京: 中国科学院金属研究所, 2012
Authors:
沈元勋
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View/Download:97/0
  |  
Submit date:2013/04/12
复合材料
钎焊
中间层
显微组织
力学性能
残余应力
Composites
Brazing
Interlayer
Microstructure
Mechanical Properties
Residual Stress
FeNiP化学镀层的制备及其与无铅焊料的润湿性及界面反应性能
学位论文
, 北京: 中国科学院金属研究所, 2012
Authors:
周海飞
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View/Download:116/0
  |  
Submit date:2013/04/12
无铅焊料
凸点下金属化层
Fenip化学镀层
可焊性
界面反应
Lead-free Solder
Under Bump Metallization
Electroless Fenip
Solderability
Solder Reactions