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Strong Connection of Single-Wall Carbon Nanotube Fibers with a Copper Substrate Using an Intermediate Nickel Layer 期刊论文
ACS NANO, 2023, 卷号: 17, 期号: 18, 页码: 18290-18298
Authors:  Gao, Zhaoqing;  Xu, Lele;  Jiao, Xinyu;  Li, Xin;  He, Chengjian;  Wang, Hao-Zike;  Sun, Chunyang;  Hou, Peng-Xiang;  Liu, Chang;  Cheng, Hui-Ming
Favorite  |  View/Download：7/0  |  Submit date：2024/01/08
single-wall carbon nanotube fiber  heterogeneous interconnection  interfacial bonding  electrical conductivity  soldering  intermediate Ni layer  
Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
Authors:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
Favorite  |  View/Download：6/0  |  Submit date：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
Authors:  Gao, Zhaoqing;  Wang, Chen;  Chai, Zhenbang;  Chen, Yinbo;  Shen, Chenyu;  Yao, Kai;  Zhao, Ning;  Wang, Yunpeng;  Ma, Haitao
Favorite  |  View/Download：103/0  |  Submit date：2022/07/14
Intermetallics  Microstructure  Temperature gradient  Preferred orientation  

Ga-21-5In-10Sn alloys

  Interfaces  
Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly 期刊论文
ACTA METALLURGICA SINICA, 2020, 卷号: 56, 期号: 10, 页码: 1433-1440
Authors:  Jiang Lin;  Zhang Liang;  Liu Zhiquan
Favorite  |  View/Download：143/0  |  Submit date：2021/02/02
diffusion welding  Al interlayer  Ni(V) transition layer  welding residual stress  Co target  finite element simulation  
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
Authors:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin;  Xiong, Xiaodong
Favorite  |  View/Download：171/0  |  Submit date：2021/02/02
Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
Authors:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
Favorite  |  View/Download：172/0  |  Submit date：2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
Authors:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
Favorite  |  View/Download：140/0  |  Submit date：2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
Authors:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
Favorite  |  View/Download：116/0  |  Submit date：2021/02/02
Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design  
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
Authors:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
Favorite  |  View/Download：108/0  |  Submit date：2021/02/02
Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design  
A new quantizing insulator soldering technology scheme for microwave module 期刊论文
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2019, 卷号: 61, 期号: 4, 页码: 979-984
Authors:  Tian, Fei-Fei;  Zhou, Ming;  Zhang, Jun Zhi
Favorite  |  View/Download：112/0  |  Submit date：2021/02/02
microwave module  quatization  soldering  solid solder ring