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Bi-induced voids at the Cu3Sn/Cu interface in eutectic SnBi/Cu solder joints 期刊论文
Scripta Materialia, 2008, 卷号: 58, 期号: 5, 页码: 409-412
Authors:  P. J. Shang;  Z. Q. Liu;  D. X. Li;  J. K. Shang
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Eutectic Snbi Alloy  Soldering  Interface  Segregation  Transmission  Electron Microscopy (Tem)  Lead-free Solders  Sn-bi  Segregation  Cu  Reliability  Bismuth  
Strong magnetoelectric coupling in multiferroic BiFeO(3)-Pb(Zr(0.52)Ti(0.48))O(3) composite films derived from electrophoretic deposition 期刊论文
Applied Physics Letters, 2008, 卷号: 93, 期号: 19
Authors:  Y. J. Wu;  J. G. Wan;  C. F. Huang;  Y. Y. Weng;  S. F. Zhao;  J. M. Liu;  G. H. Wang
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Bismuth Compounds  Composite Materials  Electrophoretic Coating  Techniques  Lead Compounds  Magnetic Particles  Magnetic Thin Films  Magnetoelectric Effects  Multiferroics  Nanoparticles  Ferroelectric Polarization  Room-temperature  Bifeo3 Ceramics  Domains  
Magnetocapacitance of polycrystalline Bi(5)Ti(3)FeO(15) prepared by sol-gel method 期刊论文
Journal of Applied Physics, 2008, 卷号: 103, 期号: 9
Authors:  X. W. Dong;  K. F. Wang;  J. G. Wan;  J. S. Zhu;  J. M. Liu
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Magnetoelectric Measurements  Bi5feti3o15