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Research on anisotropy of the 7B50 super thick plate 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2023, 卷号: 960, 页码: 16
Authors:  Wang, H.;  Zhang, Z. J.;  Cong, F. G.;  Ren, W. C.;  Gong, B. S.;  Liu, R.;  Li, R. H.;  Zhou, X. H.;  Purcek, G.;  Demirtas, M.;  Bathaee, F.;  Abedi, H. R.;  Zhang, Z. F.
Favorite  |  View/Download：12/0  |  Submit date：2024/01/08
Aluminum alloys  In -plain anisotropy  Texture  Recrystallization  Micropores aggregation  
Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
Authors:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
Favorite  |  View/Download：6/0  |  Submit date：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
Obtaining ultra-high throwing power in Cu electroplating of flexible printed circuit by fast consumption of a suppressor 期刊论文
JOURNAL OF SOLID STATE ELECTROCHEMISTRY, 2021, 页码: 11
Authors:  Wei, Xiang-Fu;  Zhu, Qing-Sheng;  Guo, Jing-Dong;  Shang, Jian-Ku
Favorite  |  View/Download：106/0  |  Submit date：2021/11/22
Copper electroplating  Throwing power (TP)  Flexible printed circuit (FPC)  Suppressor  
Revealing the size-independent hardness for geometrical similar indentations in metal 期刊论文
MATERIALS LETTERS, 2021, 卷号: 293, 页码: 4
Authors:  Lu, S. L.;  Zhang, Z. J.;  Zhu, Y. K.;  Zhang, P.;  Zhang, Z. F.
Favorite  |  View/Download：189/0  |  Submit date：2021/11/22
Hardness  Copper alloys  Finite element analysis  Stress distribution  Expanding cavity model  
Stress relaxation behaviors and mechanical properties of precipitation strengthening copper alloys 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 861, 页码: 11
Authors:  Lin, H. R.;  Shao, H. F.;  Zhang, Z. J.;  Yang, H. J.;  Sun, J. C.;  Zhang, L. B.;  Zhang, Z. F.
Favorite  |  View/Download：127/0  |  Submit date：2021/10/15
Copper alloy  Stress relaxation  Aging  Precipitation  Strength  
Revealing the maximum microhardness and thickness of hardened layers for copper with various grain sizes 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 778, 页码: 6
Authors:  Ren, C. X.;  Wang, Q.;  Hou, J. P.;  Zhang, Z. J.;  Yang, H. J.;  Zhang, Z. F.
Favorite  |  View/Download：149/0  |  Submit date：2021/02/02
Cu  Gradient microstructure  Hardened layer  Microhardness  Grain size  
Crack propagation behavior and mechanism of coarse-grained copper in cyclic torsion with axial static tension 期刊论文
INTERNATIONAL JOURNAL OF FATIGUE, 2020, 卷号: 131, 页码: 11
Authors:  Xu, J. X.;  Li, R. H.;  Zhang, P.;  Zhang, Z. F.
Favorite  |  View/Download：136/0  |  Submit date：2021/02/02
Torsional loading  Mean stress  Crack paths  Stage I fatigue crack growth  Stage II fatigue crack growth  
Nanoparticle additions promote outstanding fracture toughness and fatigue strength in a cast Al-Cu alloy 期刊论文
MATERIALS & DESIGN, 2020, 卷号: 186, 页码: 8
Authors:  Yang, Chenglin;  Zhao, Qinglong;  Zhang, Zhenjun;  Li, Linlin;  Tian, Weisi;  Liu, Rui;  Zhang, Peng;  Xu, Yijiang;  Li, Yanjun;  Zhang, Zhefeng;  Jiang, Qichuan;  Ritchie, Robert O.
Favorite  |  View/Download：138/0  |  Submit date：2021/02/02
Cast Al alloys  Fatigue strength  Fracture toughness  Nanoparticles  
Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3006-D3012
Authors:  Zhu, Q. S.;  Zhang, X.;  Liu, C. Z.;  Liu, H. Y.
Favorite  |  View/Download：131/0  |  Submit date：2021/02/02
Kinematic and isotropic strain hardening in copper with highly aligned nanoscale twins 期刊论文
MATERIALS RESEARCH LETTERS, 2018, 卷号: 6, 期号: 6, 页码: 333-338
Authors:  Wang, Hao;  You, Zesheng;  Lu, Lei
Favorite  |  View/Download：118/0  |  Submit date：2021/02/02
Nanotwins  back stress  kinematic hardening  strain rate effect  threading dislocations