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Role of Wetting Front in Dewetting of Liquid Solder Drop on Cu Thin Films 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 3, 页码: 200-205
Authors:  W. Liu;  L. Zhang;  J. K. Shang
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Dewetting  Solder  Spalling  Film Thickness  Sn  Technology  Metallurgy  Joints  Pb  
Effects of Substrate Temperature on the Growth of Polycrystalline Si Films Deposited with SiH(4)+Ar 期刊论文
Journal of Materials Science & Technology, 2009, 卷号: 25, 期号: 4, 页码: 489-491
Authors:  H. Cheng;  A. M. Wu;  J. Q. Xiao;  N. L. Shi;  L. S. Wen
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Poly-si Films  Ecr-pecvd  Substrate Temperature  Ar-dilution  Chemical-vapor-deposition  Ar-diluted Sih4  Microcrystalline Silicon  Optical-properties  h Films  Plasma  Pecvd  Hydrogen  Silane  
Diffusion Bonding of Dissimilar Intermetallic Alloys Based on Ti(2)AlNb and TiAl 期刊论文
Journal of Materials Science & Technology, 2009, 卷号: 25, 期号: 6, 页码: 819-824
Authors:  J. Y. Zou;  Y. Y. Cui;  R. Yang
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Diffusion Bonding  Interface  Shear Strength  Tial  Orthorhombic Alloy  Phase-equilibria  Microstructure  Steel  System  Strength  Joints  Creep  
Microstructure of laser remelted Ni-base alloy coating on stainless steel 期刊论文
Journal of Materials Science & Technology, 1998, 卷号: 14, 期号: 1, 页码: 49-52
Authors:  Y. Gao;  Y. Liang;  C. X. Shi
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