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Effects of Outer Shell Layer on the Electronic Transport Behaviors of Sn@SnOx Nanoparticles 期刊论文
PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS, 2020
Authors:  Ding, Ang;  Li, Tianjun;  Wang, Dongxing;  Muhammad, Javid;  Shah, Asif;  Dong, Xinglong;  Zhang, Zhidong
Favorite  |  View/Download：74/0  |  Submit date：2021/02/03
Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics 期刊论文
NANOTECHNOLOGY, 2020, 卷号: 31, 期号: 13, 页码: 9
Authors:  Wang, Xin;  Huang, Feirong;  Wang, Dongxing;  Li, Da;  Li, Pu;  Muhammad, Javid;  Dong, Xinglong;  Zhang, Zhidong
Favorite  |  View/Download：111/0  |  Submit date：2021/02/02
DC arc-discharge method  bimetallic nanoparticles  printed electronics  thermal stability  resistivity  
Nitrogen-doped graphene layer-encapsulated NiFe bimetallic nanoparticles synthesized by an arc discharge method for a highly efficient microwave absorber 期刊论文
INORGANIC CHEMISTRY FRONTIERS, 2020, 卷号: 7, 期号: 5, 页码: 1148-1160
Authors:  Qu, Xinghao;  Zhou, Yuanliang;  Li, Xiyang;  Javid, Muhammad;  Huang, Feirong;  Zhang, Xuefeng;  Dong, Xinglong;  Zhang, Zhidong
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Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics 期刊论文
Nanotechnology, 2020, 卷号: 31, 期号: 13
Authors:  Wang,Xin;  Huang,Feirong;  Wang,Dongxing;  Li,Da;  Li,Pu;  Muhammad,Javid;  Dong,Xinglong;  Zhang,Zhidong
Favorite  |  View/Download：114/0  |  Submit date：2021/02/02
DC arc-discharge method  bimetallic nanoparticles  printed electronics  thermal stability  resistivity