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Ultrasensitive Strain Sensors Based on Cu-Al Alloy Films with Voided Cluster Boundaries 期刊论文
ADVANCED MATERIALS TECHNOLOGIES, 2021, 页码: 12
Authors:  Wu, Xuping;  Chen, Honglei;  Luo, Xuemei;  Wang, Dong;  Schaaf, Peter;  Zhang, Guangping
Favorite  |  View/Download:40/0  |  Submit date:2021/10/15
channel cracks  microstructure  strain sensors  ultrasensitive  wearable electronics