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一种定向生长的铜柱凸点互连结构及其制备方法 专利
专利类型: 发明专利, 专利号: 201410709245.1, 申请日期: 2018-04-24,
Inventors:  刘志权;  孙福龙;  李财富;  祝清省;  郭敬东
Favorite  |  View/Download:18/0  |  Submit date:2021/02/02
微电子封装用纳米孪晶铜的电沉积制备及界面反应研究 学位论文
, 2018
Authors:  孙福龙
Favorite  |  View/Download:27/0  |  Submit date:2018/08/22
Electrodeposition and growth mechanism of preferentially orientated nanotwinned Cu on silicon wafer substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 10, 页码: 1885-1890
Authors:  Sun FuLong;  Gao LiYin;  Liu ZhiQuan;  Zhang Hao;  Sugahara Tohru;  Nagao Shijo;  Suganuma Katsuaki
Favorite  |  View/Download:9/0  |  Submit date:2021/02/02
NI SOLDER JOINTS  NANO-SCALE TWINS  INTERFACIAL RELIABILITY  FE-NI  COPPER  METALS  DEFORMATION  STRENGTH  DEPENDENCE  BOUNDARIES  Electrodeposition  Nanotwinned Cu  Growth mechanism  Acid adsorption