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低氧低钛GCr15轴承钢冶炼工艺研究与实践 学位论文
, 沈阳: 中国科学院金属研究所, 2020
Authors:  张良
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Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly 期刊论文
ACTA METALLURGICA SINICA, 2020, 卷号: 56, 期号: 10, 页码: 1433-1440
Authors:  Jiang Lin;  Zhang Liang;  Liu Zhiquan
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diffusion welding  Al interlayer  Ni(V) transition layer  welding residual stress  Co target  finite element simulation  
Titanium-Modified MIL-101(Cr) Derived Titanium-Chromium-Oxide as Highly Efficient Oxidative Desulfurization Catalyst 期刊论文
CATALYSTS, 2020, 卷号: 10, 期号: 9, 页码: 10
Authors:  Li, Xiaolin;  Zhang, Liang;  Sun, Yinyong
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MIL-101(Cr)  anatase titania  DBT  oxidative desulfurization  
Titanium-Modified MIL-101(Cr) Derived Titanium-Chromium-Oxide as Highly Efficient Oxidative Desulfurization Catalyst 期刊论文
CATALYSTS, 2020, 卷号: 10, 期号: 9, 页码: 10
Authors:  Li, Xiaolin;  Zhang, Liang;  Sun, Yinyong
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MIL-101(Cr)  anatase titania  DBT  oxidative desulfurization  
Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min;  He, Peng;  Xiong, Ming-Yue;  Zhao, Meng
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Lead-free solder  reliability  IMC  crack  failure  
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
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Sn-Cu  microstructures  IMC  mechanical properties  
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
Authors:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
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Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design  
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
Authors:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
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Co target assembly  Solder  Residual stress  Simulation  Taguchi method  Optimal design  
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
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Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
Favorite  |  View/Download:8/0  |  Submit date:2021/02/02