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Microstructural evolution and cracking of Pb-free ball grid array assemblies under thermal cycling 期刊论文
Journal of Materials Science & Technology, Journal of Materials Science & Technology, Journal of Materials Science & Technology, 2007, 2007, 2007, 卷号: 23, 23, 23, 期号: 1, 页码: 85-91, 85-91, 85-91
Authors:  W. Wang;  Z. G. Wang;  A. P. Xian;  J. K. Shang
Favorite  |  View/Download:22/0  |  Submit date:2012/04/13
Cbga  Cbga  Cbga  Thermal Cycling  Thermal Cycling  Thermal Cycling  Fem  Fem  Fem  Assembly  Assembly  Assembly  Cracking  Cracking  Cracking  Solder Joint Reliability  Solder Joint Reliability  Solder Joint Reliability  Level Reliability  Level Reliability  Level Reliability  Flex-substrate  Flex-substrate  Flex-substrate  Interconnect  Interconnect  Interconnect  Snagcu  Snagcu  Snagcu  Bga  Bga  Bga  Segregation  Segregation  Segregation  Packages  Packages  Packages  Behavior  Behavior  Behavior  Bismuth  Bismuth  Bismuth  
Dalian 期刊论文
Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91
Authors:  Wei WANG;  Zhongguang WANG;  Aiping XIAN;  Jianku SHANG
Favorite  |  View/Download:11/0  |  Submit date:2021/02/02
CBGA  Thermal cycling  FEM  Assembly  Cracking  
Dalian 期刊论文
Journal of Materials Science & Technology, 2007, 卷号: 23, 期号: 1, 页码: 85-91
Authors:  Wei WANG;  Zhongguang WANG;  Aiping XIAN;  Jianku SHANG
Favorite  |  View/Download:8/0  |  Submit date:2021/02/02
CBGA  Thermal cycling  FEM  Assembly  Cracking  
Microstructure and fracture of Pb-free solder interconnects in CBGA packages under thermal cycling 期刊论文
ACTA METALLURGICA SINICA, 2006, 卷号: 42, 期号: 6, 页码: 647-652
Authors:  Wang, W;  Wang, ZG;  Xian, AP;  Shang, JK
Favorite  |  View/Download:12/0  |  Submit date:2021/02/02
Pb-free solder  interconnect  ceramic ball grid array (CBGA)  finite element method  thermal cycling