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Microstructure and mechanical properties of 3D-printed nano-silica reinforced alumina cores 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 20, 页码: 30282-30293
Authors:  Liu, Jiaqi;  Li, Qiaolei;  Huo, Mingda;  Zhang, Xiuyuan;  Yue, Xinyan;  Liang, Jingjing;  Li, Jinguo
Favorite  |  View/Download：63/0  |  Submit date：2022/10/08
Ceramic cores  3D printing  Nano particle  Microstructure  Mechanical properties  
Flexible SiC nanowire aerogel with excellent thermal insulation properties 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 15, 页码: 22172-22178
Authors:  Liang, Xianpeng;  Shao, Zhuojie;  Wu, Zhen;  Wang, Jingyang
Favorite  |  View/Download：47/0  |  Submit date：2022/09/16
SiC Nanowire aerogel  Freeze-drying  High temperature resistance  Flexible  Thermal insulation material  
Mechanical, electrical properties and microstructures of hot-pressed B4C-WB2 composites 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 14, 页码: 20211-20219
Authors:  Ma, Ke;  Shi, Xiaoguo;  Cao, Xiaozhou;  Yang, Zhibin;  Zuo, Jun;  Xu, Jingjun;  Li, Meishuan
Favorite  |  View/Download：91/0  |  Submit date：2022/09/16
B4C-WB2 composites  Orientation growth  Mechanical properties  Toughening mechanism  Electrical conductivity  
Mechanical, electrical properties and microstructures of hot-pressed B4C-WB2 composites 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 14, 页码: 20211-20219
Authors:  Ma, Ke;  Shi, Xiaoguo;  Cao, Xiaozhou;  Yang, Zhibin;  Zuo, Jun;  Xu, Jingjun;  Li, Meishuan
Favorite  |  View/Download：89/0  |  Submit date：2022/09/16
B4C-WB2 composites  Orientation growth  Mechanical properties  Toughening mechanism  Electrical conductivity  
High infrared emissivity energy-saving coatings based on LaMnO3 perovskite ceramics 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 14, 页码: 20110-20115
Authors:  Han, Rifei;  Tariq, Naeem ul Haq;  Zhao, Feng;  Zhao, Lijia;  Liu, Housheng;  Wang, Jiqiang;  Cui, Xinyu;  Xiong, Tianying
Favorite  |  View/Download：38/0  |  Submit date：2022/07/14
High infrared emissivity  Perovskite  Energy-saving coating  Solid-state reaction  
A SiC/C foam microwave absorbing material for PIM darkroom box in simulating space environment 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 10, 页码: 14626-14632
Authors:  Lin, Lihai;  Li, Chusen;  Qin, Jiayong;  Du, Chunlin;  Yao, Pei;  Zhang, Jinsong
Favorite  |  View/Download：32/0  |  Submit date：2022/07/14
SiC/C foam microwave absorbing material  Passive intermodulation (PIM)  Space environment  Microwave absorbing box  
Achieving high temperature broadband electromagnetic reflection reduction via Al2O3 / FeCrAl refractory composite coating 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 9, 页码: 13340-13347
Authors:  Zhao, Shixin;  Ma, Hua;  Li, Xiaoquan;  Sui, Sai;  Shao, Tengqiang;  Wang, Jun;  Feng, Bo;  Wei, Dongbing;  Li, Qiaolei;  Qu, Shaobo
Favorite  |  View/Download：35/0  |  Submit date：2022/07/14
Electromagnetic reflection reduction  Functional composite coating  Insensitive to temperature  FeCrAl  
Enhancing wear resistance of TiN coating by gradient bias voltage and arc-enhanced glow discharge 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 6, 页码: 8746-8750
Authors:  Wang, Y. H.;  Guo, F.;  Ren, H.;  Hu, S. Y.;  Chen, Y. J.;  Zhao, Y. H.;  Gong, F.;  Xie, Z. W.
Favorite  |  View/Download：45/0  |  Submit date：2022/07/01
TiN coating  Arc ion plating  Arc-enhanced glow discharge  Gradient bias  Wear  
Modelling and grinding characteristics of unidirectional C-SiCs 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 6, 页码: 8314-8324
Authors:  Qu, Shuoshuo;  Yao, Peng;  Gong, Yadong;  Yang, Yuying;  Chu, Dongkai;  Zhu, Qingsheng
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C-SiCs  Theoretical model  Numerical simulation model  Grinding performance  Micromaterial removal mechanism  
Microstructural evolution and growth kinetics of interfacial reaction layers in SUS430/Ti3SiC2 diffusion bonded joints using a Ni interlayer 期刊论文
CERAMICS INTERNATIONAL, 2022, 卷号: 48, 期号: 4, 页码: 4484-4496
Authors:  Cheng, Qiang;  Zheng, LiLi;  Li, XiChao;  Xu, Bin;  Sun, MingYue;  Shi, Jing;  Dai, ZuoQiang;  Zhang, TieZhu;  Zhang, HongXin
Favorite  |  View/Download：33/0  |  Submit date：2022/07/01
Solid diffusion bonding  Ti3SiC2 ceramic  SUS430  Interfacial microstructure  Growth kinetics