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Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7
Authors:  Gao, Zhaoqing;  Sun, Hao;  Cao, Jinwei;  Wang, Chen;  Hussain, Muhammad Muzammal;  Xiao, Chengyu;  Chen, Yinbo;  Dong, Chong;  Wang, Yunpeng;  Ma, Haitao
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Ag/sn reflective film  Nucleation thermodynamics  Ag4Sn  X-ray quantitative analysis  Synchrotron radiation  
Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7
Authors:  Gao, Zhaoqing;  Sun, Hao;  Cao, Jinwei;  Wang, Chen;  Hussain, Muhammad Muzammal;  Xiao, Chengyu;  Chen, Yinbo;  Dong, Chong;  Wang, Yunpeng;  Ma, Haitao
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Ag/sn reflective film  Nucleation thermodynamics  Ag4Sn  X-ray quantitative analysis  Synchrotron radiation  
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
Authors:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan
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Cu-Sn IMC  Growth behavior  External stress effect  Isothermal aging  
Effect of Cu Preferential Orientation on the Microstructure and Properties of Anodized CuxO Films 期刊论文
EUROPEAN JOURNAL OF INORGANIC CHEMISTRY, 2020, 卷号: 2020, 期号: 3, 页码: 261-268
Authors:  Gao, Zhaoqing;  Cao, Jinwei;  Wang, Chen;  Chen, Yinbo;  Muzammal, Hussain Muhammad;  Wang, Weiqiang;  Sun, Hao;  Ma, Haitao;  Wang, Yunpeng
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Electrochemistry  Copper  Kinetics  Reaction rate  Surface chemistry  
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
Authors:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
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alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength