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Electrodeposited Ni-W coatings as the effective reaction barrier at Ga-21.5In-10Sn/Cu interfaces 期刊论文
SURFACES AND INTERFACES, 2022, 卷号: 30, 页码: 12
Authors:  Gao, Zhaoqing;  Wang, Chen;  Gao, Nan;  Guo, Shihao;  Chen, Yinbo;  Chai, Zhenbang;  Wang, Yunpeng;  Ma, Haitao
Favorite  |  View/Download：47/0  |  Submit date：2022/07/01
Ni-W-graphene coatings  Interfacial reaction barrier  CuGa 2 layer  Ga-21  5In-10Sn liquid alloys  Ni -W solid solution  
Interfacial reactions at Ga-21.5In-10Sn/Cu liquid-solid interfaces under isothermal and non-isothermal conditions 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2022, 卷号: 282, 页码: 16
Authors:  Gao, Zhaoqing;  Wang, Chen;  Chai, Zhenbang;  Chen, Yinbo;  Shen, Chenyu;  Yao, Kai;  Zhao, Ning;  Wang, Yunpeng;  Ma, Haitao
Favorite  |  View/Download：41/0  |  Submit date：2022/07/14
Intermetallics  Microstructure  Temperature gradient  Preferred orientation  

Ga-21-5In-10Sn alloys

  Interfaces  
Insight into the effect of reorganized chemical short-range orders at Ga-based alloys/Cu interfaces on the nucleation and growth of CuGa2 crystals 期刊论文
MATERIALS LETTERS, 2022, 卷号: 307, 页码: 4
Authors:  Gao, Zhaoqing;  Chen, Yinbo;  Wang, Chen;  Yao, Kai;  Chai, Zhenbang;  Ma, Haitao;  Wang, Yunpeng;  Huang, Mingliang
Favorite  |  View/Download：111/0  |  Submit date：2021/12/09
Crystal growth  Electronic materials  Intermetallic alloys and compounds  Ga-based alloys  Chemical short-range order  
Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
Authors:  Chen, Yinbo;  Gao, Zhaoqing;  Liu, Zhi-Quan
Favorite  |  View/Download：47/0  |  Submit date：2022/07/01
Sn-Bi-Ag solder  Grain orientation  Temperature gradient  Aging  Ag3Sn  
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
Authors:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
Favorite  |  View/Download：65/0  |  Submit date：2022/01/27
Insight into the interatomic competitive mechanism for interfacial stability of room temperature liquid GaInSn/Cu electrode 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2021, 卷号: 270, 页码: 14
Authors:  Gao, Zhaoqing;  Chen, Yinbo;  Dong, Chong;  Chen, Fei;  Huang, Mingliang;  Ma, Haitao;  Wang, Yunpeng
Favorite  |  View/Download：91/0  |  Submit date：2021/10/15
Liquid GaInSn alloys  Interfacial stability  Interatomic affinity  Competitive reactive mechanism  Gibbs free energy change  
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
Authors:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
Favorite  |  View/Download：75/0  |  Submit date：2021/03/15
Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7
Authors:  Gao, Zhaoqing;  Sun, Hao;  Cao, Jinwei;  Wang, Chen;  Hussain, Muhammad Muzammal;  Xiao, Chengyu;  Chen, Yinbo;  Dong, Chong;  Wang, Yunpeng;  Ma, Haitao
Favorite  |  View/Download：92/0  |  Submit date：2021/02/02
Ag/sn reflective film  Nucleation thermodynamics  Ag4Sn  X-ray quantitative analysis  Synchrotron radiation  
Low temperature engineering feasibility of high reflective Ag-Sn films from experimental and thermodynamic views 期刊论文
MATERIALS CHEMISTRY AND PHYSICS, 2020, 卷号: 254, 页码: 7
Authors:  Gao, Zhaoqing;  Sun, Hao;  Cao, Jinwei;  Wang, Chen;  Hussain, Muhammad Muzammal;  Xiao, Chengyu;  Chen, Yinbo;  Dong, Chong;  Wang, Yunpeng;  Ma, Haitao
Favorite  |  View/Download：93/0  |  Submit date：2021/02/02
Ag/sn reflective film  Nucleation thermodynamics  Ag4Sn  X-ray quantitative analysis  Synchrotron radiation  
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
Authors:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan
Favorite  |  View/Download：63/0  |  Submit date：2021/02/02
Cu-Sn IMC  Growth behavior  External stress effect  Isothermal aging