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Understanding Interlayer Coupling in TMD-hBN Heterostructure by Raman Spectroscopy 期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2018, 卷号: 65, 期号: 10, 页码: 4059-4067
Authors:  Ding, L;  Ukhtary, MS;  Chubarov, M;  Choudhury, TH;  Zhang, F;  Yang, R;  Zhang, A;  Fan, JA;  Terrones, M;  Redwing, JM;  Yang, T;  Li, MD;  Saito, R;  Huang, SX
Favorite  |  View/Download:1/0  |  Submit date:2018/12/25
2-D material  interference effect  low-frequency (LF) vibration  Raman enhancement  
The mechanism of Pd distribution in the process of FAB formation during Pd-coated Cu wire bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 16, 页码: 13774-13781
Authors:  Du, YH;  Liu, ZQ;  Ji, HJ;  Li, MY;  Wen, M
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Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
Authors:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR;  Suganuma, K;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.;  Zhang, H (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
Favorite  |  View/Download:14/0  |  Submit date:2018/06/05
Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth  
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
Authors:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD;  Zhang, L;  Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
Favorite  |  View/Download:11/0  |  Submit date:2018/06/05
Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion  
Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy 期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1333-1336
Authors:  Wei, S;  Zhou, LJ;  Guo, JD
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thermal interface materials  low-melting-temperature alloy  Ti-coated diamond particles  
Study on the composite coating process of oxide particles in magnetic thin films 期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1250-1253
Authors:  Li, B;  Liu, GM;  Liu, ZQ
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Core material  composite coating  resistivity  magnetic properties  
Electrodeposition of anisotropic NiFe thin films for integrated high-frequency micro-inductor 期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1241-1245
Authors:  Yang, LL;  Gao, LY;  Chen, CH;  Liu, ZQ
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micro-inductor  NiFe thin film  in-plane anisotropy  magnetic electroplating  
Preparation of poly(vinyl alcohol)-based separator with pore-forming additive for lithium-ion batteries 期刊论文
SPRINGER, 2017, 卷号: 28, 期号: 23, 页码: 17516-17525
Authors:  Xiao, Wei;  Zhang, Kaiyue;  Liu, Jianguo;  Yan, Chuanwei;  Xiao, W (reprint author), Chinese Acad Sci, Inst Met Res, Lab Corros & Protect, Shenyang 110016, Liaoning, Peoples R China.
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Magnetotransport in Ultrathin 2-D Superconducting Mo2C Crystals 期刊论文
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, 2017, 卷号: 53, 期号: 11, 页码: -
Authors:  Song, Shuang;  Wang, Libin;  Xu, Chuan;  Cheng, Hui-Ming;  Ren, Wencai;  Kang, Ning;  Kang, N (reprint author), Peking Univ, Key Lab Phys & Chem Nanodevices, Beijing 100871, Peoples R China.;  Kang, N (reprint author), Peking Univ, Dept Elect, Beijing 100871, Peoples R China.
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2-d Superconductivity  Chemical Vapor Deposition (Cvd)  Transition Metal Carbides (Tmcs)  Magnetotransport  
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Authors:  Gao, Li-Yin;  Liu, Zhi-Quan;  Li, Cai-Fu;  Liu, ZQ (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.
Favorite  |  View/Download:53/0  |  Submit date:2017/08/17
Fe-ni Under Bump Metallization (Ubm)  Thermal Cycling  Microstructural Evolution  Lifetime  Recrystallization  Electron Backscatter Diffraction (Ebsd)