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Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints 期刊论文
MATERIALS CHARACTERIZATION, 2021, 卷号: 178, 页码: 8
Authors:  Gao, Li-Yin;  Luo, Yi-Xiu;  Wan, Peng;  Liu, Zhi-Quan
Favorite  |  View/Download:14/0  |  Submit date:2021/10/15
Solder joint  Intermetallic compound  Mechanical property  Nano-indentation  First principle calculation  
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
Authors:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
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The effect of finish layer on the interfacial cracking failure of Au-Si bonding 期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
Authors:  Gao, Li-Yin;  Wen, Jian;  Li, Cai-Fu;  Chen, Chunhuan;  Liu, Zhi-Quan
Favorite  |  View/Download:15/0  |  Submit date:2021/02/02
AuSi bonding  NiCo  Intermetallic compounds (IMCs)  Failure analysis  Crack  
Composition dependent mobility and bandgaps in (La0.05BaxSr0.95-x)SnO3 epitaxial films 期刊论文
APPLIED PHYSICS LETTERS, 2020, 卷号: 117, 期号: 7, 页码: 5
Authors:  Li, Kaifeng;  Gao, Qiang;  Zhao, Li;  Lv, Kai;  Yin, Lichang;  Liu, Qinzhuang
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Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
Authors:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
Favorite  |  View/Download:11/0  |  Submit date:2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9
Authors:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan
Favorite  |  View/Download:12/0  |  Submit date:2021/02/02
Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism  
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
Authors:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
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Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point  
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
Authors:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
Favorite  |  View/Download:10/0  |  Submit date:2021/02/02
Sn nanowire  Template electrodeposition  Microstructural characterization  Liquid bath melting  Lead-free solder  Melting point  
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
Authors:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
Favorite  |  View/Download:13/0  |  Submit date:2021/02/02
Fe-Ni  Electrodeposition  Transmission electron microscopy (TEM)  Interfacial structure  
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
Authors:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
Favorite  |  View/Download:16/0  |  Submit date:2021/02/02
Fe-Ni  Electrodeposition  Transmission electron microscopy (TEM)  Interfacial structure