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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
Authors:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
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Fe-Ni under bump metallization (UBM)  Intermetallic compounds (IMCs)  Electromigration (EM)  Diffusion  Vacancy formation  
一种定向生长的铜柱凸点互连结构及其制备方法 专利
专利类型: 发明专利, 专利号: 201410709245.1, 申请日期: 2018-04-24,
Authors:  刘志权;  孙福龙;  李财富;  祝清省;  郭敬东
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低偏析异质籽晶制备单晶高温合金的籽晶熔合区形成机制研究 期刊论文
金属学报, 2018, 期号: 03, 页码: 419-427
Authors:  郭静;  李金国;  刘纪德;  黄举;  孟祥斌;  孙晓峰
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镍基单晶高温合金  籽晶  凝固界面  熔合区  
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
Authors:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD;  Zhang, L;  Zhu, QS (reprint author), Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
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Stress-relaxation  Void Formation  Electromigration  Reliability  Sn  Interconnections  Thermomigration  Metallization  Mechanisms  Diffusion  
Investigation on highly efficient thermal interface materials: a new attempt to bond heat-conducting particles using low-melting-temperature alloy 期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 1333-1336
Authors:  Wei, S;  Zhou, LJ;  Guo, JD
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thermal interface materials  low-melting-temperature alloy  Ti-coated diamond particles  
一种镍基高温合金或不锈钢连接用含硅硼的中间层合金及其应用 专利
专利类型: 发明专利, 专利号: 201610179946.8, 申请日期: 2018-01-02,
Authors:  刘纪德;  李金国;  孙元;  李博;  金涛;  周亦胄;  孙晓峰
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激光增材制造98M合金的微观组织 期刊论文
稀有金属材料与工程, 2017, 期号: 10, 页码: 2999-3004
Authors:  赵成磊;  刘纪德;  李金国;  裴文利;  赵镶
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激光增材制造  枝晶  偏析  
一种以FeP合金作为接焊层的凸点封装结构 专利
专利类型: 发明专利, 专利号: 201310416014.7, 申请日期: 2017-09-26,
Authors:  郭敬东;  周海飞;  祝清省;  刘志权
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一种以FeNi合金或FeNiP合金作为反应界面层的柱状凸点封装结构 专利
专利类型: 发明专利, 专利号: 201310415003.7, 申请日期: 2017-08-25,
Authors:  刘志权;  郭敬东;  祝清省;  曹丽华
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力电热多场耦合作用下微电子产品可靠性测试平台 专利
专利类型: 发明专利, 专利号: 201210563644.2, 申请日期: 2017-06-23,
Authors:  崔学顺;  郭敬东;  祝清省;  刘志权;  吴迪;  张磊;  曹丽华
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