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Self-catalytic growth and characterization of AlGaN nanostructures with high Al composition 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 页码: 9
Authors:  Liu, Zitong;  Shen, Longhai;  Chen, Jianjin;  Zhang, Xinglai
Favorite  |  View/Download:6/0  |  Submit date:2022/07/01
Microstructural evolution and failure analysis of Sn-Bi57-Ag0.7 solder joints during thermal cycling 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 11
Authors:  Chen, Yinbo;  Wang, Changchang;  Gao, Yue;  Gao, Zhaoqing;  Liu, Zhi-Quan
Favorite  |  View/Download:23/0  |  Submit date:2022/01/27
High-temperature aging time-induced composition and thickness evolution in the native oxides film on Sn solder substrate 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 20
Authors:  Qiao, Chuang;  Sun, Xu;  Wang, Youzhi;  Hao, Long;  Liu, Xiahe;  An, Xizhong
Favorite  |  View/Download:31/0  |  Submit date:2021/11/22
Fabrication of high-conductivity RGO film at a temperature lower than 1500 degrees C by electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 10
Authors:  Lv, Meijuan;  Wei, Qinwei;  Cao, Shuo;  Guo, Jingdong;  Ren, Wencai;  Cheng, Huiming
Favorite  |  View/Download:44/0  |  Submit date:2021/10/15
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
Authors:  Chen, Yinbo;  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
Favorite  |  View/Download:39/0  |  Submit date:2021/03/15
Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 4, 页码: 2967-2975
Authors:  Du, Yahong;  Gao, Li-Yin;  Yu, Daquan;  Liu, Zhi-Quan
Favorite  |  View/Download:35/0  |  Submit date:2021/02/03
Effects of Al content in Fe-Al raw material alloy on shape and microwave absorption of Fe-based nanocapsules prepared by arc discharged method 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 页码: 11
Authors:  Li, Yuan;  Shi, Gui-Mei;  Tong, Min;  Li, Shu-Tong;  Shi, Fa-Nian;  Yu, Di
Favorite  |  View/Download:33/0  |  Submit date:2021/02/02
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue;  Zhao, Meng;  Xu, Kai-kai
Favorite  |  View/Download:33/0  |  Submit date:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
Favorite  |  View/Download:30/0  |  Submit date:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei;  Jiang, Nan;  Xu, Kai-kai
Favorite  |  View/Download:31/0  |  Submit date:2021/02/02