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Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
Authors:  Zhu, QS;  Zhang, X;  Li, SJ;  Liu, CZ;  Li, CF
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Highly Stable Transparent Conductive Electrodes Based on Silver-Platinum Alloy-Walled Hollow Nanowires for Optoelectronic Devices 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2018, 卷号: 10, 期号: 42, 页码: 36128-36135
Authors:  Zhou, KL;  Han, CB;  Li, CF;  Jiu, JT;  Yang, Y;  Li, L;  Wang, H;  Liu, JB;  Liu, ZQ;  Yan, H;  Suganuma, K
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Ag Nanowires  Ag@Pt alloy  transparent conductive electrodes  corrosion resistance  flexible optoelectronic devices  
一种从锡铝合金表面可控制备单晶锡纳米线/微米线的方法 专利
专利类型: 发明专利, 专利号: 201510789340.1, 申请日期: 2018-08-14,
Authors:  李财富;  刘志权
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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2018, 卷号: 34, 期号: 8, 页码: 1305-1314
Authors:  Gao, LY;  Zhang, H;  Li, CF;  Guo, JD;  Liu, ZQ
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Fe-Ni under bump metallization (UBM)  Intermetallic compounds (IMCs)  Electromigration (EM)  Diffusion  Vacancy formation  
Development of low-alloyed and rare-earth-free magnesium alloys having ultra-high strength 期刊论文
ACTA MATERIALIA, 2018, 卷号: 149, 页码: 350-363
Authors:  Pan, HC;  Qin, GW;  Huang, YM;  Ren, YP;  Sha, XC;  Han, XD;  Liu, ZQ;  Li, CF;  Wu, XL;  Chen, HW;  He, C;  Chai, LJ;  Wang, YZ;  Nie, JF;  Qin, GW (reprint author), Northeastern Univ, Minist Educ, Sch Mat Sci & Engn, Key Lab Anisotropy & Texture Mat, Shenyang 110819, Liaoning, Peoples R China.;  Nie, JF (reprint author), Chongqing Univ, Sch Mat Sci & Engn, Chongqing 400044, Peoples R China.;  Wang, YZ (reprint author), Ohio State Univ, Dept Mat Sci & Engn, 2041 N Coll Rd, Columbus, OH 43210 USA.
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Slow-speed Extrusion  Zn-zr Alloy  Ca-mn Alloy  Mechanical-properties  Low-temperature  Grain-refinement  Microstructure Evolution  Mg-3al-1zn Alloy  Prismatic-slip  Pure Magnesium  
A unique hybrid-structured surface produced by rapid electrochemical anodization enhances bio-corrosion resistance and bone cell responses of beta-type Ti-24Nb-4Zr-8Sn alloy 期刊论文
SCIENTIFIC REPORTS, 2018, 卷号: 8, 页码: -
Authors:  Liu, CF;  Lee, TH;  Liu, JF;  Hou, WT;  Li, SJ;  Hao, YL;  Pan, HB;  Huang, HH;  Huang, HH (reprint author), Natl Yang Ming Univ, Inst Oral Biol, Taipei, Taiwan.;  Huang, HH (reprint author), Natl Yang Ming Univ, Dept Dent, Taipei, Taiwan.;  Huang, HH (reprint author), China Med Univ, Grad Inst Basic Med Sci, Taichung, Taiwan.;  Huang, HH (reprint author), China Med Univ Hosp, Dept Med Res, Taichung, Taiwan.;  Huang, HH (reprint author), Asia Univ, Dept Bioinformat & Med Engn, Taichung, Taiwan.;  Huang, HH (reprint author), Taipei Vet Gen Hosp, Dept Stomatol, Taipei, Taiwan.;  Huang, HH (reprint author), Taipei City Hosp, Dept Educ & Res, Taipei, Taiwan.
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Elastic-deformation Behavior  Biomedical Titanium-alloys  Mechanical-properties  In-vitro  Osteoblast Differentiation  Nanoscale Topography  Protein Adsorption  Orthodontic Wires  Anodic-oxidation  Focal Adhesion  
一种定向生长的铜柱凸点互连结构及其制备方法 专利
专利类型: 发明专利, 专利号: 201410709245.1, 申请日期: 2018-04-24,
Authors:  刘志权;  孙福龙;  李财富;  祝清省;  郭敬东
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The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 740, 页码: 500-509
Authors:  Tian, FF;  Li, CF;  Zhou, M;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.
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Heterogeneous Binary-systems  Chemical-compound Layers  2 Elementary Substances  Eutectic Snin Solder  Intermetallic Compounds  Phase Identification  Reaction-diffusion  Growth-kinetics  Joint  Transformations  
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
Authors:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
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Lead-free Solders  Interfacial Reactions  Sn-ag  Intermetallic Compounds  Rich Solders  Joints  Growth  Reliability  Substrate  Strength  
Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 degrees C 期刊论文
NANOSCALE, 2018, 卷号: 10, 期号: 11, 页码: 5254-5263
Authors:  Li, WL;  Li, CF;  Lang, FP;  Jiu, JT;  Ueshima, M;  Wang, H;  Liu, ZQ;  Suganuma, K;  Li, WL (reprint author), Osaka Univ, Grad Sch Engn, Dept Adapt Machine Syst, Yamadaoka 2-1, Suita, Osaka, Japan.;  Jiu, JT (reprint author), Osaka Univ, ISIR, Mihogaoka 8-1, Ibaraki, Osaka 5670047, Japan.;  Jiu, JT (reprint author), Senju Met Ind Co Ltd, Adachi Ku, Senju Flashido Cho 23, Tokyo 1208555, Japan.
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Printed Electronics  Nanoparticles  Patterns  Oxide  Films  Decomposition  Reduction  Inkjet  Substrate  Au