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A Gate Programmable van der Waals Metal-Ferroelectric-Semiconductor Vertical Heterojunction Memory
期刊论文
ADVANCED MATERIALS, 2022, 页码: 10
Authors:
Li, Wanying
;
Guo, Yimeng
;
Luo, Zhaoping
;
Wu, Shuhao
;
Han, Bo
;
Hu, Weijin
;
You, Lu
;
Watanabe, Kenji
;
Taniguchi, Takashi
;
Alava, Thomas
;
Chen, Jiezhi
;
Gao, Peng
;
Li, Xiuyan
;
Wei, Zhongming
;
Wang, Lin-Wang
;
Liu, Yue-Yang
;
Zhao, Chengxin
;
Zhan, Xuepeng
;
Han, Zheng Vitto
;
Wang, Hanwen
Favorite
  |  
View/Download:43/0
  |  
Submit date:2023/05/09
2D ferroelectrics
array
memristive device
multi-bit storage
van der waals heterostructures
The non-dendritic microstructure arising from grain boundary formation and wetting: A phase-field simulation and experimental investigation of semi-solid deformation
期刊论文
MATERIALS & DESIGN, 2022, 卷号: 223, 页码: 12
Authors:
Ren, Jian-kun
;
Sun, Ming-yue
;
Chen, Yun
;
Xu, Bin
;
Liu, Wei-feng
;
Jiang, Hai -yang
;
Cao, Yan-fei
;
Li, Dian-zhong
Favorite
  |  
View/Download:49/0
  |  
Submit date:2023/05/09
Phase -field method
Semi -solid deformation
Grain boundary wetting
Non-dendritic microstructure
The non-dendritic microstructure arising from grain boundary formation and wetting: A phase-field simulation and experimental investigation of semi-solid deformation
期刊论文
MATERIALS & DESIGN, 2022, 卷号: 223, 页码: 12
Authors:
Ren, Jian-kun
;
Sun, Ming-yue
;
Chen, Yun
;
Xu, Bin
;
Liu, Wei-feng
;
Jiang, Hai -yang
;
Cao, Yan-fei
;
Li, Dian-zhong
Favorite
  |  
View/Download:35/0
  |  
Submit date:2023/05/09
Phase -field method
Semi -solid deformation
Grain boundary wetting
Non-dendritic microstructure
Anti-infection mechanism of a novel dental implant made of titanium-copper (TiCu) alloy and its mechanism associated with oral microbiology
期刊论文
BIOACTIVE MATERIALS, 2022, 卷号: 8, 页码: 381-395
Authors:
Liu, Hui
;
Tang, Yulong
;
Zhang, Shuyuan
;
Liu, Huan
;
Wang, Zijian
;
Li, Yue
;
Wang, Xinluan
;
Ren, Ling
;
Yang, Ke
;
Qin, Ling
Favorite
  |  
View/Download:130/0
  |  
Submit date:2022/07/01
Titanium-copper alloy implants
Anti-infection
Oral microbiology
Biosafety
The Confined Interlayer Growth of Ultrathin Two-Dimensional Fe3O4 Nanosheets with Enriched Oxygen Vacancies for Peroxymonosulfate Activation
期刊论文
ACS CATALYSIS, 2021, 卷号: 11, 期号: 17, 页码: 11256-11265
Authors:
Wang, Weixue
;
Liu, Yang
;
Yue, Yifan
;
Wang, Huihui
;
Cheng, Gong
;
Gao, Chunyang
;
Chen, Chunlin
;
Ai, Yuejie
;
Chen, Zhe
;
Wang, Xiangke
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  |  
View/Download:164/0
  |  
Submit date:2021/11/22
layered silicate
ultrathin
confined growth
iron oxide
oxygen vacancy
peroxymonosulfate activation
The Confined Interlayer Growth of Ultrathin Two-Dimensional Fe3O4 Nanosheets with Enriched Oxygen Vacancies for Peroxymonosulfate Activation
期刊论文
ACS CATALYSIS, 2021, 卷号: 11, 期号: 17, 页码: 11256-11265
Authors:
Wang, Weixue
;
Liu, Yang
;
Yue, Yifan
;
Wang, Huihui
;
Cheng, Gong
;
Gao, Chunyang
;
Chen, Chunlin
;
Ai, Yuejie
;
Chen, Zhe
;
Wang, Xiangke
Favorite
  |  
View/Download:192/0
  |  
Submit date:2021/11/22
layered silicate
ultrathin
confined growth
iron oxide
oxygen vacancy
peroxymonosulfate activation
Precipitates and alloying elements distribution in near alpha titanium alloy Ti65
期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 36, 页码: 91-96
Authors:
Yue, Ke
;
Liu, Jianrong
;
Zhang, Haijun
;
Yu, Hui
;
Song, Yuanyuan
;
Hu, Qingmiao
;
Wang, Qingjiang
;
Yang, Rui
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  |  
View/Download:158/0
  |  
Submit date:2021/02/02
Atom probe tomography
Titanium alloys
Precipitation
First-principles calculation
Alloying elements distribution
Precipitates and alloying elements distribution in nearαtitanium alloy Ti65
期刊论文
材料科学技术:英文版, 2020, 卷号: 36.0, 期号: 1.0, 页码: 91-96
Authors:
Ke Yue
;
Jianrong Liu
;
Haijun Zhang
;
Hui Yu
;
Yuanyuan Song
;
Qingmiao Hu
;
Qingjiang Wang
;
Rui Yang
Favorite
  |  
View/Download:212/0
  |  
Submit date:2021/02/02
Atom
probe
tomography
Titanium
alloys
Precipitation
First-principles
calculation
Alloying
elements
distribution
Ti65合金的初级蠕变和稳态蠕变
期刊论文
材料研究学报, 2020, 卷号: 000, 期号: 002, 页码: 151-160
Authors:
岳颗
;
刘建荣
;
杨锐
;
王清江
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  |  
View/Download:185/0
  |  
Submit date:2021/02/26
材料科学基础学科
蠕变机制
蠕变试验
Ti65合金
Evolution of the interfacial microstructure during the plastic deformation bonding of copper
期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 746, 页码: 1-10
Authors:
Zhang, Jian Yang
;
Sun, Ming Yue
;
Xu, Bin
;
Hu, Xin
;
Liu, Sheng
;
Xie, Bi Jun
;
Li, Dian Zhong
Favorite
  |  
View/Download:102/0
  |  
Submit date:2021/02/02
Copper bonding
Hot compression bonding
Dynamic recrystallization
Grain boundary
Dislocation wall