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A Gate Programmable van der Waals Metal-Ferroelectric-Semiconductor Vertical Heterojunction Memory 期刊论文
ADVANCED MATERIALS, 2022, 页码: 10
Authors:  Li, Wanying;  Guo, Yimeng;  Luo, Zhaoping;  Wu, Shuhao;  Han, Bo;  Hu, Weijin;  You, Lu;  Watanabe, Kenji;  Taniguchi, Takashi;  Alava, Thomas;  Chen, Jiezhi;  Gao, Peng;  Li, Xiuyan;  Wei, Zhongming;  Wang, Lin-Wang;  Liu, Yue-Yang;  Zhao, Chengxin;  Zhan, Xuepeng;  Han, Zheng Vitto;  Wang, Hanwen
Favorite  |  View/Download：43/0  |  Submit date：2023/05/09
2D ferroelectrics  array  memristive device  multi-bit storage  van der waals heterostructures  
The non-dendritic microstructure arising from grain boundary formation and wetting: A phase-field simulation and experimental investigation of semi-solid deformation 期刊论文
MATERIALS & DESIGN, 2022, 卷号: 223, 页码: 12
Authors:  Ren, Jian-kun;  Sun, Ming-yue;  Chen, Yun;  Xu, Bin;  Liu, Wei-feng;  Jiang, Hai -yang;  Cao, Yan-fei;  Li, Dian-zhong
Favorite  |  View/Download：49/0  |  Submit date：2023/05/09
Phase -field method  Semi -solid deformation  Grain boundary wetting  Non-dendritic microstructure  
The non-dendritic microstructure arising from grain boundary formation and wetting: A phase-field simulation and experimental investigation of semi-solid deformation 期刊论文
MATERIALS & DESIGN, 2022, 卷号: 223, 页码: 12
Authors:  Ren, Jian-kun;  Sun, Ming-yue;  Chen, Yun;  Xu, Bin;  Liu, Wei-feng;  Jiang, Hai -yang;  Cao, Yan-fei;  Li, Dian-zhong
Favorite  |  View/Download：35/0  |  Submit date：2023/05/09
Phase -field method  Semi -solid deformation  Grain boundary wetting  Non-dendritic microstructure  
Anti-infection mechanism of a novel dental implant made of titanium-copper (TiCu) alloy and its mechanism associated with oral microbiology 期刊论文
BIOACTIVE MATERIALS, 2022, 卷号: 8, 页码: 381-395
Authors:  Liu, Hui;  Tang, Yulong;  Zhang, Shuyuan;  Liu, Huan;  Wang, Zijian;  Li, Yue;  Wang, Xinluan;  Ren, Ling;  Yang, Ke;  Qin, Ling
Favorite  |  View/Download：130/0  |  Submit date：2022/07/01
Titanium-copper alloy implants  Anti-infection  Oral microbiology  Biosafety  
The Confined Interlayer Growth of Ultrathin Two-Dimensional Fe3O4 Nanosheets with Enriched Oxygen Vacancies for Peroxymonosulfate Activation 期刊论文
ACS CATALYSIS, 2021, 卷号: 11, 期号: 17, 页码: 11256-11265
Authors:  Wang, Weixue;  Liu, Yang;  Yue, Yifan;  Wang, Huihui;  Cheng, Gong;  Gao, Chunyang;  Chen, Chunlin;  Ai, Yuejie;  Chen, Zhe;  Wang, Xiangke
Favorite  |  View/Download：164/0  |  Submit date：2021/11/22
layered silicate  ultrathin  confined growth  iron oxide  oxygen vacancy  peroxymonosulfate activation  
The Confined Interlayer Growth of Ultrathin Two-Dimensional Fe3O4 Nanosheets with Enriched Oxygen Vacancies for Peroxymonosulfate Activation 期刊论文
ACS CATALYSIS, 2021, 卷号: 11, 期号: 17, 页码: 11256-11265
Authors:  Wang, Weixue;  Liu, Yang;  Yue, Yifan;  Wang, Huihui;  Cheng, Gong;  Gao, Chunyang;  Chen, Chunlin;  Ai, Yuejie;  Chen, Zhe;  Wang, Xiangke
Favorite  |  View/Download：192/0  |  Submit date：2021/11/22
layered silicate  ultrathin  confined growth  iron oxide  oxygen vacancy  peroxymonosulfate activation  
Precipitates and alloying elements distribution in near alpha titanium alloy Ti65 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 36, 页码: 91-96
Authors:  Yue, Ke;  Liu, Jianrong;  Zhang, Haijun;  Yu, Hui;  Song, Yuanyuan;  Hu, Qingmiao;  Wang, Qingjiang;  Yang, Rui
Favorite  |  View/Download：158/0  |  Submit date：2021/02/02
Atom probe tomography  Titanium alloys  Precipitation  First-principles calculation  Alloying elements distribution  
Precipitates and alloying elements distribution in nearαtitanium alloy Ti65 期刊论文
材料科学技术:英文版, 2020, 卷号: 36.0, 期号: 1.0, 页码: 91-96
Authors:  Ke Yue;  Jianrong Liu;  Haijun Zhang;  Hui Yu;  Yuanyuan Song;  Qingmiao Hu;  Qingjiang Wang;  Rui Yang
Favorite  |  View/Download：212/0  |  Submit date：2021/02/02
Atom  probe  tomography  Titanium  alloys  Precipitation  First-principles  calculation  Alloying  elements  distribution  
Ti65合金的初级蠕变和稳态蠕变 期刊论文
材料研究学报, 2020, 卷号: 000, 期号: 002, 页码: 151-160
Authors:  岳颗;  刘建荣;  杨锐;  王清江
Favorite  |  View/Download：185/0  |  Submit date：2021/02/26
材料科学基础学科  蠕变机制  蠕变试验  Ti65合金  
Evolution of the interfacial microstructure during the plastic deformation bonding of copper 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 746, 页码: 1-10
Authors:  Zhang, Jian Yang;  Sun, Ming Yue;  Xu, Bin;  Hu, Xin;  Liu, Sheng;  Xie, Bi Jun;  Li, Dian Zhong
Favorite  |  View/Download：102/0  |  Submit date：2021/02/02
Copper bonding  Hot compression bonding  Dynamic recrystallization  Grain boundary  Dislocation wall