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Temperature Gradient Induced Orientation Change of Bi Grains in Sn-Bi57-Ag0.7 Solder Joint
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2022, 页码: 11
Authors:
Chen, Yinbo
;
Gao, Zhaoqing
;
Liu, Zhi-Quan
Favorite
  |  
View/Download:35/0
  |  
Submit date:2022/07/01
Sn-Bi-Ag solder
Grain orientation
Temperature gradient
Aging
Ag3Sn
Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15
Authors:
Chen, Yinbo
;
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
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  |  
View/Download:61/0
  |  
Submit date:2021/03/15
The effect of finish layer on the interfacial cracking failure of Au-Si bonding
期刊论文
ENGINEERING FAILURE ANALYSIS, 2020, 卷号: 115, 页码: 8
Authors:
Gao, Li-Yin
;
Wen, Jian
;
Li, Cai-Fu
;
Chen, Chunhuan
;
Liu, Zhi-Quan
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  |  
View/Download:73/0
  |  
Submit date:2021/02/02
AuSi bonding
NiCo
Intermetallic compounds (IMCs)
Failure analysis
Crack
Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging
期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2020, 卷号: 49, 期号: 4, 页码: 9
Authors:
Tian, Feifei
;
Pang, Xueyong
;
Xu, Bo
;
Liu, Zhi-Quan
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  |  
View/Download:50/0
  |  
Submit date:2021/02/02
In-48Sn solder
polycrystalline Cu
Cu-2(In
Sn)
growth orientation
Reliability issues of lead-free solder joints in electronic devices
期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
Authors:
Jiang, Nan
;
Zhang, Liang
;
Liu, Zhi-Quan
;
Sun, Lei
;
Long, Wei-Min
;
He, Peng
;
Xiong, Ming-Yue
;
Zhao, Meng
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View/Download:84/0
  |  
Submit date:2021/02/02
Lead-free solder
reliability
IMC
crack
failure
Structure and properties of Sn-Cu lead-free solders in electronics packaging
期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
Authors:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-Quan
;
Xiong, Ming-Yue
;
Sun, Lei
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View/Download:181/0
  |  
Submit date:2021/02/02
Sn-Cu
microstructures
IMC
mechanical properties
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
Authors:
Jiang, Nan
;
Zhang, Liang
;
Liu, Zhi-quan
;
Sun, Lei
;
Xiong, Ming-yue
;
Zhao, Meng
;
Xu, Kai-kai
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View/Download:62/0
  |  
Submit date:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-quan
;
Xiong, Ming-yue
;
Sun, Lei
;
Jiang, Nan
;
Xu, Kai-kai
Favorite
  |  
View/Download:63/0
  |  
Submit date:2021/02/02
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
Authors:
Zhao, Meng
;
Zhang, Liang
;
Liu, Zhi-quan
;
Xiong, Ming-yue
;
Sun, Lei
;
Jiang, Nan
;
Xu, Kai-kai
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View/Download:53/0
  |  
Submit date:2021/02/02
Effects of Pd addition on the interfacial reactions between Cu and Al during ultrasonic welding
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 14, 页码: 12840-12850
Authors:
Du, Yahong
;
Wen, Ming
;
Ji, Hongjun
;
Li, Mingyu
;
Liu, Zhi-Quan
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View/Download:59/0
  |  
Submit date:2021/02/02