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Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly 期刊论文
ACTA METALLURGICA SINICA, 2020, 卷号: 56, 期号: 10, 页码: 1433-1440
Authors:  Jiang Lin;  Zhang Liang;  Liu Zhiquan
Favorite  |  View/Download:16/0  |  Submit date:2021/02/02
diffusion welding  Al interlayer  Ni(V) transition layer  welding residual stress  Co target  finite element simulation  
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
Authors:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin;  Xiong, Xiaodong
Favorite  |  View/Download:48/0  |  Submit date:2021/02/02
Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism