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Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
Authors:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
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View/Download：72/0
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Submit date：2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder
期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
Authors:
Meng, Zhi-Chao
;
Gao, Li-Yin
;
Liu, Zhi-Quan
Favorite
|
View/Download：69/0
|
Submit date：2021/02/02
Sn nanowire
Template electrodeposition
Microstructural characterization
Liquid bath melting
Lead-free solder
Melting point
Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
Authors:
Cao Lihua
;
Chen Yinbo
;
Shi Qiyuan
;
Yuan Jie
;
Liu Zhiquan
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View/Download：174/0
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Submit date：2021/02/02
alloy element
Sn-Ag-Cu solder
intermetallic compound
interfacial morphology
shear strength
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling
期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:
Li, Qi-hai
;
Li, Cai-Fu
;
Zhang, Wei
;
Chen, Wei-wei
;
Liu, Zhi-Qua
Favorite
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View/Download：70/0
|
Submit date：2021/02/02
62Sn36Pb2Ag solder joint
Microstructural evolution
Failure analysis
Intermetallic compound (IMC)
Thermal cycling
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling
期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
Authors:
Li, Qi-hai
;
Li, Cai-Fu
;
Zhang, Wei
;
Chen, Wei-wei
;
Liu, Zhi-Qua
Favorite
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View/Download：66/0
|
Submit date：2021/02/02
62Sn36Pb2Ag solder joint
Microstructural evolution
Failure analysis
Intermetallic compound (IMC)
Thermal cycling
