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The effects of W content on solid-solution strengthening and the critical Hall-Petch grain size in Ni-W alloy 期刊论文
SURFACE & COATINGS TECHNOLOGY, 2019, 卷号: 357, 页码: 23-27
Authors:  Ong, Chun Yee Aaron;  Blackwood, Daniel John;  Li, Yi
Favorite  |  View/Download:4/0  |  Submit date:2020/01/06
Nickel-tungsten  Hall-Petch effect  Electrodeposition  Nanocrystalline metal  Nickel alloys