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Enhanced wetting of dual-phase metallic solids by liquid metals: A new effect of interfacial reaction 期刊论文
Acta Materialia, 2013, 卷号: 61, 期号: 11, 页码: 4127-4134
Authors:  Q. Q. Lai;  L. Zhang;  N. Eustathopoulos
Favorite  |  View/Download:12/0  |  Submit date:2013/12/24
Wetting  Reactive Wetting  Contact Angle  Structured Surfaces  Systems  Kinetics  Progress  Cu  
非均匀基底上的锡钎料反应润湿 学位论文
, 北京: 中国科学院金属研究所, 2011
Authors:  赖庆全
Favorite  |  View/Download:16/0  |  Submit date:2013/04/12
反应润湿  非均匀基底  复相合金  多孔材料  锡钎料 Reactive Wetting  Heterogeneous Substrates  Dual-phase Alloy  Porous Materials  Sn-based Solder  
Fast Spreading of Liquid SnPb Solder on Gold-coated Copper Wheel Pattern 期刊论文
Journal of Materials Science & Technology, 2010, 卷号: 26, 期号: 12, 页码: 1143-1147
Authors:  W. Liu;  L. Zhang;  K. J. Hsia;  J. K. Shang
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Wetting  Reactive Wetting  Spreading  Solder  Thin Film Pattern  Liquid  Film  Morphological Wetting Transitions  Structured Surfaces  Eutectic Snpb  Films