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| Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
Authors: Cao Lihua; Chen Yinbo; Shi Qiyuan; Yuan Jie; Liu Zhiquan
  Favorite | View/Download：174/0 | Submit date：2021/02/02
alloy element Sn-Ag-Cu solder intermetallic compound interfacial morphology shear strength |
| Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
Authors: L. M.; Zhang Yang, Z. F.
Favorite | View/Download：73/0 | Submit date：2015/05/08
Intermetallic Compounds (Imc) Solder Joint Cooling Rate Solidification Adsorption Ag-cu Solder Cu6sn5 Grains In-situ Sn Alloy Nanoparticles Ag3sn Microstructure Technology Particles |
| Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
Authors: L. M. Yang; Z. F. Zhang
Favorite | View/Download：56/0 | Submit date：2013/12/24
Lead-free Solder Intermetallic Compounds Interfacial Reaction Grain Growth Sn-ag-cu Shear-strength Mechanical-properties Rare-earth Bga Joints Alloy Electromigration Reliability |
| Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
Authors: Q. K. Zhang; Z. F. Zhang
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Sn-ag/cu Solder Joints Thermal Fatigue Strain Localization Grain Rotation Dynamic Recovery Stress-relaxation Behavior Eutectic Sn-3.5ag Solder Lead-free Solders Pb-free Solders Sn-ag Tensile Properties Shear-strength Fracture-behavior Deformation Creep |
| Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文
Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216
Authors: H. Y. Liu; Q. S. Zhu; Z. G. Wang; J. D. Guo; J. K. Shang
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Intermetallic Compound Formation Sn-3.8ag-0.7cu Solder Cu Microstructure Joints |
| Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 9, 页码: 2487-2494
Authors: C. Chen; L. Zhang; J. X. Zhao; L. H. Cao; J. K. Shang
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Solder Size Effect Shear Strength Microstructure Lead-free Solder Fatigue-crack Initiation Sn-ag Fe-42ni Ni Cu |
| In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
Authors: Q. K. Zhang; Z. F. Zhang
Adobe PDF(2667Kb) | Favorite | View/Download：49/0 | Submit date：2012/04/13
Snag/cu Solder Joints Creep Fatigue In Situ Observation Strain Localization Grain Subdivision Lead-free Solders Pb-sn Solder Tensile Properties Shear-strength Deformation-behavior Sn-3.5ag Solder Strain-rate Ag Microstructure Alloys |
| Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
Authors: Kang T Y; Xiu Y Y; Hui L; Wang J J; Tong W P; Liu C Z
Favorite | View/Download：53/0 | Submit date：2021/02/26
SN-AG CU SUBSTRATE INTERFACIAL REACTIONS MICROSTRUCTURE COPPER BI TEMPERATURE STRENGTH ALLOYS JOINTS Solder Interfacial reaction Intermetallics Kinetics |
| Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376
Authors: Q. K. Zhang; Q. S. Zhu; H. F. Zou; Z. F. Zhang
Adobe PDF(2369Kb) | Favorite | View/Download：76/0 | Submit date：2012/04/13
Lead-free Solder Fatigue Fracture Interface Strain Localization Vertical Cracks Lead-free Solders Pb-free Solders Deformation-behavior Joints Tensile Cu Embrittlement Temperature Sn-3.5ag Alloy |
| Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350
Authors: H. Y. Song; Q. S. Zhu; Z. G. Wang; J. K. Shang; M. Lu
Adobe PDF(3308Kb) | Favorite | View/Download：56/0 | Submit date：2012/04/13
Lead-free Solder Sn-ag-cu Alloy Zn Addition Tensile Property Intermetallic Compound Sn-ag-cu Free Solder Alloy Interfacial Reactions Deformation Reliability Joints Ag3sn Creep |
