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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder 期刊论文
ACTA METALLURGICA SINICA, 2019, 卷号: 55, 期号: 12, 页码: 1606-1614
Authors:  Cao Lihua;  Chen Yinbo;  Shi Qiyuan;  Yuan Jie;  Liu Zhiquan
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alloy element  Sn-Ag-Cu solder  intermetallic compound  interfacial morphology  shear strength  
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
Authors:  L. M.;  Zhang Yang, Z. F.
Favorite  |  View/Download:73/0  |  Submit date:2015/05/08
Intermetallic Compounds (Imc)  Solder Joint  Cooling Rate  Solidification  Adsorption  Ag-cu Solder  Cu6sn5 Grains  In-situ  Sn  Alloy  Nanoparticles  Ag3sn  Microstructure  Technology  Particles  
Effects of Y2O3 Nanoparticles on Growth Behaviors of Cu6Sn5 Grains in Soldering Reaction 期刊论文
Journal of Electronic Materials, 2013, 卷号: 42, 期号: 12, 页码: 3552-3558
Authors:  L. M. Yang;  Z. F. Zhang
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Lead-free Solder  Intermetallic Compounds  Interfacial Reaction  Grain  Growth  Sn-ag-cu  Shear-strength  Mechanical-properties  Rare-earth  Bga Joints  Alloy  Electromigration  Reliability  
Thermal fatigue behaviors of Sn-4Ag/Cu solder joints at low strain amplitude 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2013, 卷号: 580, 页码: 374-384
Authors:  Q. K. Zhang;  Z. F. Zhang
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Sn-ag/cu Solder Joints  Thermal Fatigue  Strain Localization  Grain  Rotation  Dynamic Recovery  Stress-relaxation Behavior  Eutectic Sn-3.5ag Solder  Lead-free Solders  Pb-free Solders  Sn-ag  Tensile Properties  Shear-strength  Fracture-behavior  Deformation  Creep  
Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect 期刊论文
Journal of Materials Science-Materials in Electronics, 2013, 卷号: 24, 期号: 1, 页码: 211-216
Authors:  H. Y. Liu;  Q. S. Zhu;  Z. G. Wang;  J. D. Guo;  J. K. Shang
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Intermetallic Compound Formation  Sn-3.8ag-0.7cu Solder  Cu  Microstructure  Joints  
Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints 期刊论文
Journal of Electronic Materials, 2012, 卷号: 41, 期号: 9, 页码: 2487-2494
Authors:  C. Chen;  L. Zhang;  J. X. Zhao;  L. H. Cao;  J. K. Shang
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Solder  Size Effect  Shear Strength  Microstructure  Lead-free Solder  Fatigue-crack Initiation  Sn-ag  Fe-42ni  Ni  Cu  
In situ observations on creep fatigue fracture behavior of Sn-4Ag/Cu solder joints 期刊论文
Acta Materialia, 2011, 卷号: 59, 期号: 15, 页码: 6017-6028
Authors:  Q. K. Zhang;  Z. F. Zhang
Adobe PDF(2667Kb)  |  Favorite  |  View/Download:49/0  |  Submit date:2012/04/13
Snag/cu Solder Joints  Creep Fatigue  In Situ Observation  Strain  Localization  Grain Subdivision  Lead-free Solders  Pb-sn Solder  Tensile Properties  Shear-strength  Deformation-behavior  Sn-3.5ag Solder  Strain-rate  Ag  Microstructure  Alloys  
Effect of Bismuth on Intermetallic Compound Growth in Lead Free Solder/Cu Microelectronic Interconnect 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2011, 卷号: 27, 期号: 8, 页码: 741-745
Authors:  Kang T Y;  Xiu Y Y;  Hui L;  Wang J J;  Tong W P;  Liu C Z
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Fatigue fracture mechanisms of Cu/lead-free solders interfaces 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1367-1376
Authors:  Q. K. Zhang;  Q. S. Zhu;  H. F. Zou;  Z. F. Zhang
Adobe PDF(2369Kb)  |  Favorite  |  View/Download:76/0  |  Submit date:2012/04/13
Lead-free Solder  Fatigue Fracture  Interface  Strain Localization  Vertical Cracks  Lead-free Solders  Pb-free Solders  Deformation-behavior  Joints  Tensile  Cu  Embrittlement  Temperature  Sn-3.5ag  Alloy  
Effects of Zn addition on microstructure and tensile properties of Sn-1Ag-0.5Cu alloy 期刊论文
Materials Science and Engineering a-Structural Materials Properties Microstructure and Processing, 2010, 卷号: 527, 期号: 6, 页码: 1343-1350
Authors:  H. Y. Song;  Q. S. Zhu;  Z. G. Wang;  J. K. Shang;  M. Lu
Adobe PDF(3308Kb)  |  Favorite  |  View/Download:56/0  |  Submit date:2012/04/13
Lead-free Solder  Sn-ag-cu Alloy  Zn Addition  Tensile Property  Intermetallic Compound  Sn-ag-cu  Free Solder Alloy  Interfacial Reactions  Deformation  Reliability  Joints  Ag3sn  Creep