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Highly Stable Transparent Conductive Electrodes Based on Silver-Platinum Alloy-Walled Hollow Nanowires for Optoelectronic Devices 期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2018, 卷号: 10, 期号: 42, 页码: 36128-36135
Authors:  Zhou, KL;  Han, CB;  Li, CF;  Jiu, JT;  Yang, Y;  Li, L;  Wang, H;  Liu, JB;  Liu, ZQ;  Yan, H;  Suganuma, K
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Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379
Authors:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR;  Suganuma, K;  Liu, ZQ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.;  Zhang, H (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
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Self-catalyzed copper-silver complex inks for low-cost fabrication of highly oxidation-resistant and conductive copper-silver hybrid tracks at a low temperature below 100 degrees C 期刊论文
NANOSCALE, 2018, 卷号: 10, 期号: 11, 页码: 5254-5263
Authors:  Li, WL;  Li, CF;  Lang, FP;  Jiu, JT;  Ueshima, M;  Wang, H;  Liu, ZQ;  Suganuma, K;  Li, WL (reprint author), Osaka Univ, Grad Sch Engn, Dept Adapt Machine Syst, Yamadaoka 2-1, Suita, Osaka, Japan.;  Jiu, JT (reprint author), Osaka Univ, ISIR, Mihogaoka 8-1, Ibaraki, Osaka 5670047, Japan.;  Jiu, JT (reprint author), Senju Met Ind Co Ltd, Adachi Ku, Senju Flashido Cho 23, Tokyo 1208555, Japan.
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Bottom-Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via 期刊论文
MATERIALS, 2018, 卷号: 11, 期号: 2, 页码: -
Authors:  Sun, FL;  Liu, ZQ;  Li, CF;  Zhu, QS;  Zhang, H;  Suganuma, K;  Zhu, QS (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China.;  Liu, ZQ (reprint author), Univ Chinese Acad Sci, Beijing 100049, Peoples R China.;  Liu, ZQ (reprint author), Osaka Univ, Inst Sci & Ind Res, Osaka 5670047, Japan.
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